In a news conference at the inaugural ES Design West of SEMICON West, SEDC and Cadence announced the launch of a campaign by SEDC to actively recruit entrepreneurs and startups to NY’s growing advanced electronics cluster.
ULVAC Names New Senior Management for North American subsidiary, ULVAC Technologies, Inc.
ULVAC Technologies, Inc. has announced that Dr. Koukou Suu, of ULVAC Japan, will serve as the new CEO of ULVAC’s North American subsidiary, ULVAC Technologies, Inc., based in Methuen, MA.
Finding Marginal Semiconductor Wafer Defects
Final electrical test remains one of the best ways to assess a circuit’s ultimate viability. But we know, unfortunately, that even 100% end-of-line electrical testing of semiconductor wafers will not guarantee that chips will not fail in the field.
Changes in the Advanced Packaging Supply Chain: Opportunity or Misfortune?
Amidst a dynamic ecosystem, the semiconductor supply chain is undergoing change at various levels. Some players have successfully managed to expand into a new business model and significantly impact the IC manufacturing chain, while others have failed to take off.
New Low-Cost Thermoelectric Material Works at Room Temperature
Material could be used to cool electronic devices, overheated vehicles.
Synopsys and Ixia, a Keysight Business, Announce Collaboration to Enable Scalable Networking SoC Validation Solution
Synopsys, Inc. and Ixia, a Keysight Technologies, Inc. business, today announced a multi-year, strategic collaboration to enable a paradigm shift for system validation of complex networking system-on-chips (SoCs) using emulation and a virtual tester.
Toshiba Memory to Rebrand as “Kioxia” in October
Toshiba Memory Holdings Corporation announced today that it will officially change its name to Kioxia Holdings Corporation on October 1, 2019.
Samsung Begins Mass Production of Industry’s First 12Gb LPDDR5 Mobile DRAM for Premium Smartphones
Samsung Electronics Co. today announced that it has begun mass producing the industry’s first 12-gigabit (Gb) LPDDR5 mobile DRAM, which has been optimized for enabling 5G and AI features in future smartphones.
Tiny Vibration-Powered Robots Are the Size of the World’s Smallest Ant
Researchers have created a new type of tiny 3D-printed robot that moves by harnessing vibration from piezoelectric actuators, ultrasound sources or even tiny speakers.
Pioneer Micro Technology Launches Silvaco PDK for Its 0.35 µm Silicon Foundry CMOS Process
Silvaco Japan Co., Ltd. today announced that Pioneer Micro Technology Corp. (PMT) has begun providing a Process Development Kit (PDK) for Silvaco tool users targeting the manufacture of IC designs in PMT’s 0.35 µm CMOS process technology.
