Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Imec Doubles Energy Density Of Its Solid-State Batteries to 400Wh/Liter

Imec, a research and innovation hub in nanoelectronics, digital and energy technologies and partner in EnergyVille, announced a solid-state Li-metal battery cell with an unsurpassed energy density of 400 Wh/liter at a charging speed of 0.5C

CMP Materials Market Reaches $2.7B Amid Signs of Orders Slowing in 2019

TECHCET announced that the global market for chemical-mechanical planarization (CMP) consumable materials in semiconductor manufacturing is forecasted to grow to US$2.7 billion in 2019. However, several suppliers report softening orders for the first half of 2019 due to shifting wafer starts combined with intensified industry efforts to save slurry costs through increasing dilution.

Can We Believe The Hype About China’s Domestic IC Production Plans?

Tariffs and trade issues are forcing China to scale its domestic IC production plans, but do its claims line up with reality? IC Insights believes they do not.

Purdue and World’s Largest Semiconductor Manufacturer Collaborate To Research Secured Microelectronics Ecosystem

Purdue University and TSMC jointly announced plans Wednesday (June 12) to establish a Center for Secured Microelectronics Ecosystem aimed at ensuring a secure supply of semiconductor chips and related tools all the way from the foundry to the packaged system. The center, to be located at the Purdue University West Lafayette, Indiana campus, will perform research to ensure a secure ecosystem for the manufacture of microelectronics systems.

US-China Trade Disputes Prompt TV Makers to Cut Display Panel Demand

Amid rising concerns over the intensifying trade war between the U.S. and China, South Korean and Chinese TV makers are cutting panel orders in the second quarter, according to IHS Markit.

Nordson Announces New President and CEO

Nordson Corp. announced that Sundaram Nagarajan (Naga) has been appointed President and Chief Executive Officer, effective August 1, 2019. Mr. Nagarajan succeeds Michael F. Hilton, who previously announced his plans to retire. Upon Mr. Nagarajan’s start date, Mr. Hilton will become Senior Advisor to the Company and remain on the board of directors until he retires on December 31, 2019. Mr. Nagarajan joins Nordson following a 23-year career with Illinois Tool Works Inc. (ITW), a Fortune 200 company. He is currently the Executive Vice President, Automotive OEM Segment, for ITW, a $3.3 billion business segment.

Ultra-Low Power Chips Help Make Small Robots More Capable

An ultra-low power hybrid chip inspired by the brain could help give palm-sized robots the ability to collaborate and learn from their experiences. Combined with new generations of low-power motors and sensors, the new ASIC could help intelligent swarm robots operate for hours instead of minutes.

GLOBALFOUNDRIES and Soitec Announce Multiple Long-term SOI Wafer Supply Agreements

Agreements secure high-volume 300mm wafer supply to support a broad range of customer applications across fast growing market segments.

Renesas Electronics Develops New Processing-In-Memory Technology for Next-Generation AI Chips

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, today announced it has developed an AI accelerator that performs CNN (convolutional neural network) processing at high speeds and low power to move towards the next generation of Renesas embedded AI (e-AI), which will accelerate increased intelligence of endpoint devices

Small Currents For Big Gains In Spintronics

UTokyo researchers have created an electronic component that demonstrates functions and abilities important to future generations of computational logic and memory devices.