Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Smartkem Signs Multi-Year Agreement with FlexiIC to Develop a New Generation of CMOS for Smart Sensors

New project builds on ongoing collaboration to develop custom circuits using Smartkem’s organic transistor technology.

NVIDIA to Open Vietnam R&D Center to Bolster AI Development

NVIDIA announced today it is opening its first Vietnam research and development center, signaling its confidence in the country’s bright artificial intelligence future.

Silicon Labs Ships Four Million Chips with Wirepas for Advanced Metering Initiative

Silicon Labs today announced that they have shipped four million FG23 SoCs for smart electricity meters as part of India’s Advanced Metering Initiative (AMI).

Intel Appoints Semiconductor Leaders Eric Meurice and Steve Sanghi to Board of Directors

Intel Corporation today announced that Eric Meurice, former president, chief executive officer and chairman of ASML Holding N.V., and Steve Sanghi, chairman and interim chief executive officer of Microchip Technology Inc., have been appointed to Intel’s board of directors, effective immediately.

Entegris and U.S. Department of Commerce Announce Entry Into Award Agreement Under CHIPS Act

The funding, which further supports Entegris’ investment in the U.S. semiconductor industry, will be used for its new manufacturing center of excellence in Colorado Springs.

IPG Photonics Completes Acquisition of CleanLASER

IPG Photonics Corporation today announced that it has completed its acquisition of Clean-Lasersysteme GmbH (cleanLASER), a leader in laser cleaning systems.

Lumotive and Lattice Semiconductor to Demo Chip-Based Beam Steering for 3D Sensing at DevCon 2024

At Lattice DevCon 2024, the companies will showcase how their combined technologies transform the landscape of industrial automation, robotics, and autonomous mobility.

YES Announces Release of VertaCure XP G3 Systems for Advanced Packaging Applications

YES announced today that it is releasing VertaCure XP G3 curing systems for production.

Soitec and GlobalFoundries Collaborate in the Production of High-Performance RF-SOI Semiconductors

Soitec announced today its commitment to deliver 300mm RF-SOI substrates to GlobalFoundries (GF) for the production of GF’s leading RF-SOI technology platforms, including the company’s most advanced RF solution, 9SW.  

Beebolt and SEMI Announce Strategic Partnership to Drive Supplier Resilience and Agility

Beebolt, the AI-led collaboration platform for global trade, has  partnered with leading global industry association, SEMI, to revolutionise supplier operations in the  semiconductor industry.