NexWafe GmbH (NexWafe) today announced significant breakthroughs in its solar wafer manufacturing technology.
Micromax and Phison Partner to Launch MiPhi, Powering India’s Next-Generation of NAND Storage Technology
The joint venture will enable MiPhi to develop high-end and customized NAND storage products for enterprise, consumer, embedded, AI, and security applications for India and specific agreed-upon regions.
CreeLED Inc. Files Patent Infringement Lawsuit Against ADJ Products, LLC
Cree LED, a Penguin Solutions brand, today announced that it has filed a patent infringement lawsuit in the United States District Court for the Northern District of California against ADJ Products, LLC (ADJ).
SonicEdge Unveils World’s First MEMS Speaker-Microphone Solution for TWS Devices
SonicEdge LTD announced the launch of SonicTwin at CES 2025.
NXP to Acquire Aviva Link
NXP Semiconductors N.V. announced today that it has entered into a definitive agreement to acquire Aviva Links, a provider of Automotive SerDes Alliance (ASA) compliant in-vehicle connectivity solutions in an all-cash transaction valued at $242.5 million.
Microchip Adds MTCH2120 to its Portfolio of Turnkey Capacitive Touch Controllers
The touch controller is designed to integrate with a comprehensive ecosystem of tools to streamline development and speed time to market.
EdgeCortix Joins AI-RAN Alliance to Accelerate the Integration of AI and Next-gen RAN Infrastructure
Alliance membership enables EdgeCortix to collaborate with industry leaders and accelerate the adoption of power-efficient AI-RAN integrated systems.
SignOff Semiconductors Unveils Expansion Plans Opening a New Office in Penang, Malaysia
SignOff Semiconductors Pvt. Ltd., headquartered in Bengaluru, India, and a provider of VLSI and Embedded Design services, announced the opening of its new office in Penang, Malaysia.
Advancing Light Control: New Opportunities for Metasurfaces in Optoelectronics
A global review of advancements in integrating metasurfaces – thin planar arrays of nanostructures – into optoelectronic devices highlights their potential to transform technologies such as Light Emitting Diodes (LEDs), lasers, optical modulators, and photodetectors.
HKU Engineering Researchers Develop Revolutionary Diamond Fabrication Technology
A research team led by Professor Zhiqin Chu, Associate Professor in the Department of Electrical & Electronic Engineering, and Professor Yuan Lin, Professor in the Department of Mechanical Engineering, Faculty of Engineering at the University of Hong Kong (HKU), has developed a groundbreaking method for massively producing ultrathin and ultra-flexible diamond membranes.
