A team of polymer chemists and engineers from Carnegie Mellon University have developed a new methodology that can be used to create a class of stretchable polymer composites with enhanced electrical and thermal properties.
Call For SEMICON WEST 2019 “Best Of West” Award Applications
The application deadline for the Best of West award, presented annually by Semiconductor Digest magazine and SEMI Americas, is June 14. Exhibitors can apply using the online submission form.
Mentor Certified for Latest TSMC 5nm FinFET Process and TSMC-SoIC 3D Chip Stacking Tech
Mentor, a Siemens business, announced that several tools in its Calibre nmPlatform and Analog FastSPICE (AFS) Platform have been certified on TSMC’s 5nm FinFET process technology.
CEA-Leti Develops CMOS Process for High-Performance MicroLEDs That Could Overcome Display-Size Obstacles
Leti, a research institute of CEA Tech, recently announced a new technology for fabricating GaN microLED displays for applications ranging from smart watches to TVs with no size limit.
Semiconductor Leaders Strike Agreement on Global Policy Agenda
The Semiconductor Industry Association welcomed a policy agreement reached by global semiconductor industry leaders at the 23rd annual meeting of the World Semiconductor Council this week in Xiamen, China.
Silicon Reclaim Wafer Market Logs Second Year of Strong Growth but Softening Ahead
Logging a second consecutive year of strong growth, the silicon wafer reclaim market surged 19 percent to $603 million in 2018 on the strength of a record number of reclaimed wafers processed, SEMI, the industry association representing the global electronics manufacturing and design supply chain, reported in its 2018 Silicon Reclaim Wafer Characterization Summary.
IEEE International Electron Devices Meeting Announces 2019 Call for Papers
The 65th annual IEEE International Electron Devices Meeting(IEDM), to be held at the Hilton San Francisco Union Square hotel December 7–11, 2019, has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research and development.
Edwards Responds to United Nations’ New Greenhouse Gas Guidelines
The Intergovernmental Panel on Climate Change (IPCC), the United Nations’ body for assessing the science related to climate change, released the latest refinement to its 2006 Guidelines.
USC ISI and Intel Custom Foundry Collaborate to Spur Microelectronics Innovation
The partnership through Information Sciences Institute’s (ISI) MOSIS service will offer multi-project-wafer (MPW) runs for the microelectronics community, integrating MOSIS manufacturing services with Intel’s high-performance device fabrication technology.
Sensors/Actuators Reach Record Sales on Slower Growth
After two strong years, the sensor and actuator market has cooled off as a result of inventory drawdowns, slowing unit shipments, and economic uncertainty, says report.
