Nowadays, there is broad consensus in the memory industry that the 28nm/22nm silicon lithography nodes will be the last technology nodes for eFlash. This is not because of fundamental scalability limitations, but because of economic barriers. Therefore a new embedded NVM for code/data storage is needed.
Sharp Meets Flat in Tunable 2D Material
A Rice University lab wants its products to look sharp, even at the nanoscale. Its latest creation is right on target.
Thinnest Optical Waveguide Channels Light Within Just Three Layers of Atoms
Engineers at the University of California San Diego have developed the thinnest optical device in the world–a waveguide that is three layers of atoms thin.
TCS Launches Robotic Automation Solutions to Accelerate Digital Transformation in the Semiconductor Industry
Tata Consultancy Services’ robotic data factory solution, built at its new Center of Excellence, will significantly reduce the response time to anomalies in semiconductor production.
Diodes Incorporated to Acquire Lite-On Semiconductor Corporation
Diodes Incorporated and Lite-On Semiconductor Corporation today announced the companies have entered into an agreement that provides for the acquisition of LSC by Diodes.
Global Semiconductor Process Control Equipment: 6% CAGR Projection Over the Next Five Years
The global semiconductor process control equipment market is expected to post a CAGR of close to 6% during the period 2019-2023.
Amtech Announces New Order for Its 300mm HTR Furnace
Amtech Systems, Inc. announced today that its subsidiary, Bruce Technologies, Inc., has received a significant new order for its 300mm high-temp diffusion furnace from a top-tier power semiconductor customer.
Everspin Honored with Best of Show Award for Most Innovative Flash Memory Technology at Flash Memory Summit 2019
Everspin Technologies, Inc. was honored with a Flash Memory Summit 2019 Best of Show Award for most innovative flash memory technology at last night’s awards ceremony.
Toshiba Memory’s XFMEXPRESS Technology Awarded ‘Best of Show’ at Flash Memory Summit 2019
Toshiba Memory America, Inc. announced that its XFMEXPRESS technology for removable PCIe attached, NVM memory devices has received a Flash Memory Summit ‘Best of Show’ award.
Quartz Consumables Revenues a Postive Sign Amidst Equipment Sales Declines
TECHCET announced that the global market for quartz equipment consumable materials used in semiconductor manufacturing is forecasted to drop a mere ~3% to US$1.26 billion in 2019.
