As the computational demands of artificial intelligence (AI) and machine learning workloads accelerate, traditional parallel attached DRAM memory has presented a major roadblock for next-generation CPUs, which require an increased number of memory channels to deliver more memory bandwidth.
Toshiba Memory Introduces XL-FLASH Storage Class Memory Solution
Toshiba Memory America, Inc. (TMA), the U.S.-based subsidiary of Toshiba Memory Corporation, today announced the launch of a new Storage Class Memory (SCM) solution: XL-FLASH.
Lenovo and Intel Announce Multiyear Global Collaboration to Extend HPC and AI Leadership
Intel and Lenovo today announced a multiyear collaboration focused on the rapidly growing opportunity in the convergence of high-performance computing (HPC) and artificial intelligence (AI) to help accelerate solutions for the world’s most challenging problems.
A Wearable Device So Thin and Soft You Won’t Even Notice It
Device also can serve as robotic skin, relaying information back to the user.
MagnaChip Offers 0.35 micron 700V Ultra-High Voltage Process Technologies for Various System Requirements
MagnaChip Semiconductor Corporation, a designer and manufacturer of analog and mixed-signal semiconductor products, announced today it now offers 0.35 micron 700V Ultra-High Voltage process technologies (UHV) suitable for different system requirements for AC-DC converter ICs and LED driver ICs.
Hprobe to Present Breakthrough Technology for Ultra-Fast Magnetic Testing of MRAM Devices above 2 Tesla
Hprobe, a provider of turnkey semiconductor Automatic Test Equipment (ATE) for magnetic devices, will present at the MRAM Developer Day 2019*, a new technology of magnetic generator for ultra-fast testing time (less than one second) of Magnetic Tunnel Junction (MTJ) for Spin Transfer Torque (STT) MRAM devices under perpendicular magnetic field at above 2 Tesla.
Wafer Backgrinding Tape Market to Reach $261.42 Mn, Globally, by 2026 at 4.9% CAGR
Rise in demand for ultra-thin wafers, increase in need for wafer fabrication, surge in in focus toward wafer surface protection during grinding process, and high-end development in the semiconductor industry propel the growth of the global wafer backgrinding tape market.
Synthesizing Single-Crystalline Hexagonal Graphene Quantum Dots
A KAIST team has designed a novel strategy for synthesizing single-crystalline graphene quantum dots, which emit stable blue light.
Experimental Observation of a New Class of Materials: Excitonic Insulators
Scientists make first observation of an ‘excitonic insulator’, an exotic state first predicted in 1960s.
Sage Microelectronics and Everspin Partner to Bring Spin-transfer Torque MRAM to Next Generation Enterprise SSD Devices
Everspin Technologies, Inc., a developer and manufacturer of Magnetoresistive RAM (MRAM) persistent memory solutions, announced its partnership with Sage Microelectronics Corporation.
