Applied Materials, Inc. today announced a definitive agreement under which Applied will acquire all outstanding shares of Kokusai Electric for $2.2 billion in cash from global investment firm KKR.
AKHAN Semiconductor Appoints Vice Admiral Charles W. Moore Jr. to the Company’s Board of Directors
AKHAN Semiconductor, a technology company specializing in the fabrication and application of lab-grown, electronic-grade diamonds, announced today the appointment of Vice Admiral Charles W. Moore Jr. to its Board of Directors.
Jury Unanimously Finds Huawei Misappropriated CNEX’s Advanced Semiconductor Trade Secrets
CNEX Labs Inc., developer of a transformative architecture for solid state drive (SSD) controllers, today announced that a federal jury has found that Huawei Technologies Co. misappropriated CNEX’s trade secrets.
Robert H. Dennard, DRAM Inventor and Scaling Pioneer, to Receive Semiconductor Industry’s Top Honor
The Semiconductor Industry Association (SIA) today announced Dr. Robert H. Dennard, pioneer of transformational breakthroughs in semiconductor technology and IBM Fellow Emeritus, has been named the 2019 recipient of SIA’s highest honor, the Robert N. Noyce Award.
Alpha and Omega Semiconductor Releases 700V and 600V αMOS5 Super Junction MOSFETs in 300mm Fab
Alpha and Omega Semiconductor, a designer, developer, and global supplier of a broad range of power semiconductors and power ICs, today announced the release of 700V and 600V αMOS5 Super Junction MOSFET families in 300mm technologies.
Researchers Teleport Information Within a Diamond
Researchers from the Yokohama National University have teleported quantum information securely within the confines of a diamond. The study has big implications for quantum information technology – the future of how sensitive information is shared and stored.
Emerging Semiconductor Substrates: What Will Be The Next Game-Changer?
Yole Développement (Yole) expects the emerging semiconductor substrate market to surpass US$400 million, growing at a 24% CAGR between 2018 and 2024.
MEMS Manufacturing for 2020 and Beyond
With so much growth ahead of us, how will the design and manufacture of MEMS keep pace with industry demand for higher levels of innovation and integration, lower cost and lower power, smaller footprints, and faster design cycles — all while meeting acceptable price points?
IEEE Approves New Power Modeling Standard
Silicon Integration Initiative has announced that its Unified Power Model, developed with major contributions from IBM and GLOBALFOUNDRIES, has been approved as IEEE 2416-2019, a new Standard for Power Modeling to Enable System Level Analysis, which complements UPF/IEEE 1801-2018 Standard for Design and Verification of Low-Power, Energy-Aware Electronic Systems.
Applying Pressure Is Way Toward Generating More Electricity From Waste Heat
Osaka University-led researchers apply pressure to a thermoelectric material to better understand quantum phenomena and in doing so are able to increase the material’s ability to produce electricity from waste heat by 100%.
