Leti, a research institute of CEA Tech, and Radiall, a global manufacturer of leading-edge interconnect solutions, announced a five-year common lab to design innovative antennas, radio frequency (RF) to meet infrastructure requirements of 5G networks and photonics components for harsh environments.
SEMI Teams with Cornell University To Accelerate Technology Development Using Machine Learning and AI
SEMI today announced a research and development (R&D) project to speed technology progress and problem-solving in microelectronics manufacturing and across the supply chain by driving new efficiencies using machine learning (ML) and artificial intelligence (AI).
Lattice Semiconductor Wins AI Breakthrough Award
Lattice Semiconductor Corporation announced the company’s popular Lattice sensAI solutions stack was named “Best AI-Based Solution for Engineering” in the 2019 AI Breakthrough Awards.
What to Make of the ‘Quantum Advantage’ at SEMICON West?
SEMICON West participants will gain first look at Quantum Economic Development Consortium (QED-C) roadmapping activities devoted to the pursuit of U.S. leadership in the rapidly emerging global quantum industry.
CEA’s Precise Localization Technology Boosts Quality Control and Efficiency in Desoutter’s Products
Desoutter Industrial Tools and CEA-Leti today announced a precise, new indoor-location system that enables factories to monitor tools in real time and help manage their use by workers to improve efficiency, safety, security and quality control on assembly lines.
Air Products Awarded Contract to Supply MEMC Korea’s New 300mm Silicon Wafer Fab in Cheonan, South Korea
Air Products today announced it has been awarded a contract by MEMC Korea to supply a new 300mm silicon wafer fab being built adjacent to its existing fab in Cheonan, South Korea.
Shell Increases Versatility of Nanowires
Laboratory experiments show that semiconductor nanowires can be tuned over wide energy ranges.
NXP Semiconductors Appoints Three New Non-Executive Directors
NXP Semiconductors N.V. announced the results of its Annual General Meeting of Shareholders, held on June 17, 2019 in Amsterdam.
TDK Announces Worldwide Availability of MEMS-Based “Sonar on a Silicon Chip” Ultrasonic Time-of-Flight Sensors
This ToF sensor utilizes a tiny ultrasonic transducer chip to send out a pulse of ultrasound and then listen for echoes returning from targets in the sensor’s field-of-view.
Rahul Goyal of Intel Re-elected Board Chair of Silicon Integration Initiative
Rahul Goyal of Intel has been reelected to a one-year term as board chair of Silicon Integration Initiative, a research and development joint venture that provides standard interoperability solutions for integrated circuit design tools.
