Researchers develop a robust quantum highway with switch to control electron movement.
SEMI Europe Announces Educational Leaders Board
The European Chips Skills Academy (ECSA), an EU-funded initiative coordinated by SEMI, today announced the formation of the Educational Leaders Board to help bridge the talent gap in Europe’s microelectronics sector.
NUS Researchers Develop a Novel Technique to Fabricate Three-Dimensional Circuits for Advanced Electronics
CHARM3D paves the way for the efficient printing of free-standing 3D structures that offer high electrical conductivity, self-healing capabilities and recyclability — a boon for electronics in healthcare, communications and security.
3D-Micromac Receives Laser-Trimming-System Order from Infineon for New Dresden Smart Power Fab
3D-Micromac AG equips Infineon Technologies Dresden GmbH & Co. KG with production equipment for laser trimming.
Researchers Develop Device to Make Artificial Intelligence More Energy Efficient
Energy consumption from artificial intelligence could be reduced by a factor of at least 1,000 with this device.
AMI Joins NXP Semiconductors Partner Program
AMI announced that it has formally joined the NXP Semiconductors Partner Program.
Amkor Signs Preliminary Memorandum of Terms with US Department of Commerce for Arizona Advanced Packaging and Test Facility
Amkor Technology, Inc., a provider of semiconductor packaging and test services, announced today it has signed a non-binding preliminary memorandum of terms with the US Department of Commerce to receive proposed funding as part of the CHIPS and Science Act.
Fractile Raises $15M Seed Funding
Fractile, a UK company building a groundbreaking new AI chip to deliver exponential performance improvements for AI models, has today exited stealth and announced $15m (£12m) in seed funding.
IDTechEx Discusses Co-Packaged Optics (CPO) Packaging Technology Trends and Market Trajectory
Over the past decade, the capacity of data center Ethernet switches has surged from 0.64 Tbps to 25.6 Tbps, driven by the adoption of 64×400 Gbps or 32×800 Gbps pluggable optical transceiver modules.
Analog Devices and Flagship Pioneering Announce Strategic Partnership
Analog Devices, Inc. (Nasdaq: ADI), a global semiconductor leader, and Flagship Pioneering, the bioplatform innovation company, today announced a strategic alliance to accelerate the development of a fully digitized biological world.
