The U.S. Department of Defense (DoD) has awarded Intel Foundry Phase Three of its Rapid Assured Microelectronics Prototypes – Commercial (RAMP-C) program.
GlobalFoundries Commits to Achieving Net Zero Emissions and Carbon-Neutral Power by 2050
New goals target additional reductions and removal of greenhouse gas emissions to help fight climate change.
SEMI Applauds U.S. CHIPS Act Award for Samsung Electronics Facilities
The award includes $6.4 billion in grants and an investment tax credit to help fund two new leading-edge logic fabs, a research and development fab, and an advanced packaging facility in Taylor, Texas.
Aaron Woolf, Dylan Peterson Join SIA Team
Woolf will serve as director of global policy for economic security and Peterson will be a communications associate.
Silicontent and yieldWerx Announce Collaboration
yieldWerx continues to partner with global semiconductor companies and has partnered with Silicontent to bring improvements in yield management and quality.
SK hynix Partners with TSMC
SK hynix Inc. announced today that it has recently signed a memorandum of understanding with TSMC for collaboration to produce next-generation HBM and enhance logic and HBM integration through advanced packaging technology.
Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
Omni Design Technologies, a provider of high-performance, low-power mixed-signal intellectual property (IP), today announced it has joined the Intel Foundry Accelerator IP Alliance.
Properties of New Materials for Microchips Can Now Be Measured Well
Reseachers of Delft University of Technology demonstrated measuring performance properties of ultrathin silicon membranes.
Silvaco Expands Partnership with Micron
Silvaco Group, Inc., a provider of TCAD, EDA software, and SIP solutions that enable semiconductor design and AI through software and innovation, today announced an enhanced partnership with Micron Technology, Inc.
With High NA EUV, Intel Foundry Opens New Frontier in Chipmaking
Intel is industry’s first mover on High NA EUV, enabling continued process leadership beyond Intel 18A.
