Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

IMAPS & IPC to Host Onshoring Workshop

The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host a Workshop to discuss ongoing progress and forward-looking strategies to drive the Onshoring Advanced Packaging and Assembly, April 29 – May 1, 2024, in Arlington, Virginia. 

Rapidus Announces U.S. Subsidiary and Opens Silicon Valley Office

Rapidus Corporation today announced it has formed a U.S. subsidiary, Rapidus Design Solutions (RDS); opened an office for the Americas in Santa Clara, California; and named long-time semiconductor executive Henri Richard as general manager and president of the U.S. organization.

Infineon and Amkor Announce Extended Partnership

Infineon Technologies AG is strengthening its outsourced backend manufacturing footprint in Europe and announced a multi-year partnership with Amkor Technology, Inc., a provider of semiconductor packaging and test services.

Semiconductor Advanced Packaging Market Size to Record $22.79B Growth from 2024-2028

The global semiconductor advanced packaging market size is estimated to grow by USD 22.79 billion from 2024 to 2028, according to Technavio.

Global PC Shipments Return to Growth and Pre-Pandemic Volumes in the First Quarter of 2024

After two years of decline, the worldwide traditional PC market returned to growth during the first quarter of 2024 (1Q24) with 59.8 million shipments, growing 1.5% year over year, according to preliminary results from the International Data Corporation (IDC) Worldwide Quarterly Personal Computing Device Tracker.

SEMI Issues Statement on Change to U.S. CHIPS Act Notice of Funding Opportunity

SEMI today issued the following statement from Ajit Manocha, SEMI President and CEO, after the United States Government announced it will no longer move forward with the Notice of Funding Opportunity for CHIPS funding for the construction, modernization, or expansion of semiconductor research and development (R&D) facilities in the United States.

Semiconductor Research Corporation Announces 2024 Call for Research, $13.8M in Funding Opportunities

Semiconductor Research Corporation (SRC) is announcing the start of solicitation season with $13.8 million in funding opportunities.

The Building Block for Magnetoelectric Spin-Orbit Logic

An international team, led by researchers from the Nanodevices group at CIC nanoGUNE, succeeded in voltage-based magnetization switching and reading of magnetoelectric spin-orbit nanodevices.

Breakthrough for Next-Generation Digital Displays

Researchers at Linköping University, Sweden, have developed a digital display screen where the LEDs themselves react to touch, light, fingerprints and the user’s pulse, among other things.

Global Semiconductor Equipment Billings Slip to $106.3 Billion in 2023

Worldwide sales of semiconductor manufacturing equipment edged down 1.3% to $106.3 billion in 2023 from an all-time record of $107.6 billion in 2022, SEMI, the industry association representing the global electronics design and manufacturing supply chain, reported today.