Micron’s automotive memory and storage enable central compute, digital cockpit and advanced driver-assistance systems for Qualcomm customers.
SEMI Talent Forum 2024 to Help Build Next-Generation Chip Industry Workforce
Post-graduates and onboarding talent will connect with local companies to explore semiconductor industry career paths and employment opportunities at the SEMI Talent Forum, May 1, 2024 at the University of Swansea.
SEMI Applauds U.S. CHIPS Act Award for TSMC Manufacturing Facilities
“We applaud the U.S. Department of Commerce for taking this significant step to enhance the resilience of the domestic semiconductor supply chain,” said Joe Stockunas, President of SEMI Americas.
Breakthrough in Memory Technology: Next-Generation Optoelectronic Memory with Tellurene
Researchers developed a novel optoelectronic memory device that addresses the issues of conventional floating-gate nonvolatile memory devices.
Electronic System Design Industry Posts $4.4 Billion in Revenue in Q4 2023, ESD Alliance Reports
Electronic System Design (ESD) industry revenue increased 14% to $4,423 million in the fourth quarter of 2023 from the $3,879.9 million logged in the third quarter of 2023, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report.
SEMI University Launches In-Person Courses to Help Semiconductor Industry Workforce Build Skills
Aiming to help the global semiconductor workforce expand its skills to address the talent gap, SEMI today announced the expansion of the SEMI University learning platform to include in-person trainings.
Everspin Technologies Unveils PERSYST
Everspin Technologies, Inc. announced today the new brand name PERSYST for its persistent memory product family.
China to Become World’s Largest Source of IC Wafer Capacity by 2026
According to the Global Wafer Capacity 2024 report from Knometa Research, wafer capacity for IC production is projected to grow on average 7.1% each year through 2026.
TSMC Awarded $6.6B in CHIPS and Science Act Funding for Investments in Arizona Fabs
TSMC announces 2nm technology at second fab and a new third fab to produce 2nm or more advanced chips.
R2 Semiconductor Files New Patent Infringement Lawsuit Against Intel In France
R2 Semiconductor, a Third Point Ventures portfolio company, today announced it has filed a patent infringement lawsuit in Le Tribunal Judiciaire de Paris against the French subsidiaries of Intel Corp and its customers, Dell Technologies and Hewlett Packard Enterprise Company and HP Inc
