Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Alchip Announces Successful 2nm Test Chip Tapeout

Joins the first wave of new semiconductor transistor architecture development.

European Chips Skills Academy Unveils Comprehensive Skills Strategy to Boost Competitiveness of Semiconductor Ecosystem

The European Chips Skills Academy (ECSA), an EU-funded initiative coordinated by SEMI, today announced the publication of the Skills Strategy report by DECISION Etudes & Conseil that outlines the strategic approaches required to tackle Europe’s growing talent shortage in the semiconductor sector.

MACOM Selected to Lead Advanced GaN-on-SiC Semiconductor Technology Development Project

MACOM Technology Solutions Inc. today announced that it has been selected to lead a development project to establish advanced gallium nitride (“GaN”) on silicon carbide (SiC) process technologies for radio frequency (“RF”) and microwave applications.

Tenstorrent Expands Deployment of Arteris’ Network-on-Chip IP to Next-Generation of Chiplet-Based AI Solutions

Arteris’ FlexNoC interconnect IP optimizes the on-chip communication flow supporting superior performance, power and area for advancing AI chip and chiplet computing.

CMP Ancillaries to Double in 2025

Recovery in wafer volumes and fab expansions to drive demand.

Pfeiffer Vacuum+Fab Solutions Introduces New Handheld Measuring Gauge

Pfeiffer Vacuum+Fab Solutions – a member of the Busch Group – introduces the TPG 202 Neo, a new Piezo/Pirani handheld gauge designed to meet the demands of various industrial and laboratory environments.

Emerging Trends and Key Markets in 2.5D and 3D Semiconductor Packaging Technologies

This article explores the technology development trends in 2.5D and 3D packaging technologies and the key market growth drivers.

SIA Commends Selections for CHIPS R&D Flagship Facilities

The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending the selections for the first two CHIPS for America National Semiconductor Technology Center (NSTC) facilities.

First Annual SEMIEXPO Heartland Event to Assemble Leaders in Smart Manufacturing and Smart Mobility

With automotive electronics and Industry 4.0 serving as key semiconductor industry growth drivers, SEMI Americas’ inaugural SEMIEXPO Heartland event will gather key smart manufacturing and smart mobility stakeholders from April 1-2, 2025, at the Indiana Convention Center in Indianapolis.

Infineon Launches New Generation of GaN Power Discretes

Infineon Technologies AG today announced the launch of a new family of high-voltage discretes, the CoolGaN Transistors 650 V G5, further strengthening its Gallium Nitride (GaN) portfolio.