Allegro MicroSystems, Inc. today announced the appointment of Jennie Raubacher to Allegro’s Board of Directors as an independent director.
Semiconductor Metal Plating Chemicals to Top $1 Billion
TECHCET is forecasting Metal Plating Chemicals to grow 7% in 2024, to reach over $1 billion.
SiMa.ai Secures Funds and Readies New Generative Edge AI Platform
SiMa.ai, the software-centric, embedded edge machine learning system-on-chip company, today announced it has raised an additional $70M of funding led by Maverick Capital, with participation from Point72 and Jericho, as well as existing investors Amplify Partners, Dell Technologies Capital, Lip-Bu Tan and others.
Binghamton University Receives $1M to Support Job Training in Electronics Manufacturing
New cleanroom equipment creates ideal space for students to learn advanced packaging processes.
SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana
SK hynix Inc. announced today that it will invest an estimated $3.87 billion in West Lafayette, Indiana to build an advanced packaging fabrication and R&D facility for AI products.
Aspinity Establishes Technical Advisory Board
Aspinity today announced the formation of its technical advisory board, including Kymeta President and CEO Rick Bergman and Boston Consulting Group (BCG) Advisor Bill Earnshaw.
Nordson Electronics Solutions Expands the SELECT Synchro Selective Soldering Equipment Family
Nordson Electronics Solutions releases the Synchro 3, a new model in the SELECT Synchro selective soldering equipmen family for high-volume printed circuit board assembly applications.
Empower Semiconductor Announces European Sales Expansion
Empower Semiconductor today announced a representation and distribution agreement with Dimac Red Spa.
Chemistry Researchers Modify Solar Technology to Produce a Less Harmful Greenhouse Gas
Researchers in the UNC-Chapel Hill Chemistry Department are using semiconductors to harvest and convert the sun’s energy into high-energy compounds that have the potential to produce environmentally friendly fuels.
Henkel Semiconductor Capillary Underfill Enables AI and Advanced Packaging Designs
Henkel today announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements of the market’s most demanding advanced packages, like those used in artificial intelligence (AI) and high-performance computing (HPC) applications.
