Thirty-year software, engineering, and semiconductor industry veteran brings deep technical knowledge and C-level executive management experience to Dirac.
Nordson Electronics Solutions to Feature High-Throughput Fluid Dispensing Technologies at SEMICON Taiwan 2024
Nordson Electronics Solutions will feature the latest technologies in fluid dispensing for semiconductor advanced packaging at the SEMICON Taiwan tradeshow, booth L0516.
Lita Shon-Roy, President/CEO of TECHCET Wins Gold Stevie Award in 2024 International Business Awards
Lita Shon-Roy, President and CEO of TECHCET, was named the winner of a Gold Stevie Award in the Thought Leader of The Year – Business Services category in The 21st Annual International Business Awards for her work as a Semiconductor Materials Supply Chain Thought Leader.
NVIDIA and Global Partners Launch NIM Agent Blueprints for Enterprises to Make Their Own AI
NVIDIA today announced NVIDIA NIM Agent Blueprints, a catalog of pretrained, customizable AI workflows that equip millions of enterprise developers with a full suite of software for building and deploying generative AI applications for canonical use cases, such as customer service avatars, retrieval-augmented generation and drug discovery virtual screening.
MEMS & Sensors Executive Congress 2024 to Highlight AI and Sensors Enabling New Applications
Industry visionaries and experts will gather October 7-9 at the MEMS & Sensors Executive Congress (MSEC 2024) at the Château-Bromont Hotel in Bromont, Quebec, Canada for insights into the latest trends and innovations in sensorization.
Unconventional Interface Superconductor Could Benefit Quantum Computing
New material developed by UC Riverside-led team offers promise for developing more scalable and reliable quantum computing components.
EV Group Highlights 3D Integration Process Solutions at SEMICON Taiwan 2024
EV Group (EVG) today announced that it will highlight key advances in hybrid and fusion wafer bonding, infrared (IR) laser layer release technology, and lithography for advanced semiconductor and micro-electronics manufacturing and packaging at the SEMICON Taiwan 2024 expo in Taipei, Taiwan on September 4-6.
FuriosaAI Unveils RNGD, A Leading AI Inference Chip
FuriosaAI today announced the unveiling of RNGD (pronounced “Renegade”), a leading AI accelerator, at Hot Chips 2024.
Lattice Named a 2024 Top Workplace in the Greater Bay Area
Lattice Semiconductor today announced it has been recognized as a 2024 Top Workplace in the San Francisco Bay Area by The San Francisco Chronicle.
New IBM Processor Innovations to Accelerate AI on Next-Generation IBM Z Mainframe Systems
IBM revealed architecture details for the upcoming IBM Telum II Processor and IBM Spyre Accelerator at Hot Chips 2024.
