Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

New SEMI University Online Certification Programs to Fast-Track Semiconductor Skills Development

Aiming to help the global semiconductor industry address its talent gap by training and upskilling workers, SEMI today announced that its SEMI University learning platform now offers online course certification programs designed to fast-track semiconductor career development.

Chips Industry May Not Be Fit For Purpose By 2030, Says GlobalData

Next-generation chips represent the next frontier of semiconductor technology, incorporating advancements in design, materials, manufacturing process, performance, and packaging. As computing tasks become more demanding and data-intensive, next-generation chips promise faster speeds and better energy efficiency.

POET Announces Design Win and Collaboration with Foxconn Interconnect Technology

POET and FIT have entered into a collaboration to develop 800G and 1.6T pluggable optical transceiver modules using POET optical engines with an aim to address the growth in demand from cutting-edge AI applications and high-speed data center networks.

Key Measures of Global Semiconductor Manufacturing Industry Strength Improve in Q1 2024, SEMI Reports

The global semiconductor manufacturing industry in the first quarter of 2024 showed signs of improvement with an uptick in electronic sales, stabilizing inventories and an increase in installed wafer fab capacity, SEMI announced today.

Porotech Selects ClassOne Solstice Single-Wafer Platform

ClassOne Technology and Porotech today announced that Porotech has selected the ClassOne Solstice single-wafer platform for the development and manufacture of GaN products for applications requiring silicon wafer substrates.

NEO Semiconductor Reveals a Performance Boosting Floating Body Cell Mechanism for 3D X-DRAM

NEO Semiconductor, a developer of innovative technologies for 3D NAND flash and DRAM memory, today announced a performance boosting Floating Body Cell Mechanism for 3D X-DRAM.

Polar Semiconductor Announces Plans to Expand Semiconductor Manufacturing Facility in Minnesota

Polar Semiconductor, the only U.S.-based manufacturer specializing in sensor, power, and high-voltage semiconductors, today announced plans to expand its Bloomington, Minnesota manufacturing facility and branch into innovative technologies to serve new customers and markets.

Semiconductor Manufacturing Equipment Market Size is Set to Grow By $46.68B From 2024-2028

The global semiconductor manufacturing equipment market size is estimated to grow by $46.68B from 2024-2028, according to Technavio.

Kevin O’Buckley to Lead Foundry Services at Intel

Intel Corporation today announced the appointment of Kevin O’Buckley as senior vice president and general manager of Foundry Services, the customer service and ecosystem operations division of Intel Foundry.

ASMC 2024 Opens With AI, Smart Manufacturing and Sustainability in Focus

The 35th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2024) opens today to focus on critical topics ranging from yield management and metrology to new developments in artificial intelligence, smart manufacturing and sustainability.