Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

DGIST Develops Next-Gen AI Semiconductor Devices Resembling the Human Brain

DGIST (President Kunwoo Lee) announced on Thursday February 29th that a team led by Prof. Kwon Hyuk-jun of the Department of Electrical Engineering and Computer Science has developed a next-generation AI semiconductor technology that mimics the human brain’s efficiency in AI and neuromorphic systems.

UT, ACC, Texas Institute for Electronics to Launch Semiconductor Training Center

A new partnership among The University of Texas at Austin, Austin Community College District and Texas Institute for Electronics (TIE) will make Central Texas a premier hub for comprehensive workforce development that will fuel the needs of America’s semiconductor industry.

Thermal Management Expo Europe Unveils Business Opportunities for High-Tech Industries

The flagship event of the global Thermal Management Expo portfolio, Thermal Management Expo North America is a unique, free-to-attend exhibition and conference that connects senior engineers and key decision-makers with suppliers specializing in thermal systems and materials.

SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform-based Product

This marks SEMIFIVE’s third commercialization of its SoC Platform solutions built on Samsung Foundry’s mass production proven FinFET process technologies.

IDTechEx Explores Technology Trends in Dielectric Materials for Next Generation 2.5D and 3D Semiconductor Packaging

The semiconductor industry continually pushes packaging technology boundaries to meet the demand for higher chip performance and efficiency. Bandwidth is one of the critical factors defining the amount of data transmitted between dies on a package

Applied Materials Earns Intel’s 2024 EPIC Distinguished Supplier Award

Applied Materials, Inc. today announced that it has earned Intel’s EPIC Distinguished Supplier Award.

Omdia: Surge in Display Polarizer Capacity and Emerging Technologies Propelling Growth in 2024 Display Market

New data from Omdia has revealed 8% year-over-year growth in display polarizer demand is expected in 2024 which is set to drive a 2% increase in year-over-year revenue, propelled by intense price competition and substantial investments by Chinese manufacturers.

Lidar Market Size Worth $ 5.16B, Globally, by 2031

The Global Lidar Market is projected to grow at a CAGR of 8.01% from 2024 to 2031, according to a new report published by Verified Market Research.

SEMI 3D & Systems Summit to Spotlight Trends in Hybrid Bonding, Chiplet Design and Environmental Sustainability

Leading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, 12-14 June, 2024, in Dresden for insights into the latest heterogeneous integration innovations for semiconductor applications enabling the future of intelligent and sustainable systems.

Wolfspeed Tops Out World’s Largest, Most Advanced Silicon Carbide Facility

Wolfspeed held a ceremony to celebrate the topping out of construction at the $5 billion John Palmour Manufacturing Center for Silicon Carbide.