Lambda, the AI developer cloud, today announced a partnership with South Korea’s largest mobile telecommunications company, SK Telecom (SKT).
Alpha and Omega Semiconductor Expands Surface Mount Package Offering with New LFPAK 5×6 Package
Alpha and Omega Semiconductor Limited, a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, today announced its new highly robust power MOSFET LFPAK 5×6 package.
Pfeiffer Vacuum Achieves Gold Medal in EcoVadis Sustainability Ranking
Pfeiffer Vacuum, a member of the global Busch Group, has once again been awarded the prestigious EcoVadis Gold Medal for its site in Asslar.
TSMC Breaks Ground, Secures Subsidy for German Plant
The Taiwan Semiconductor Manufacturing Company (TSMC) has begun work on a 10-billion-euro plant in Dresden as the European Union approves state assistance for the project.
Pfeiffer Vacuum Introduces New HiQuad Neo Mass Spectrometer
With its new HiQuad Neo mass spectrometer, Pfeiffer Vacuum combines powerful performance with flexibility and user-friendly operation.
MULTI-DOF Technology from HEIDENHAIN Gives Hybrid Bonding a Boost
While a reduction in production throughput had been an acceptable compromise for smaller structures in previous years, a significant increase in productivity is now back on the agenda of semiconductor manufacturers. HEIDENHAIN encoders with MULTI-DOF TECHNOLOGY unlock these new dimensions of higher accuracy and performance.
Diraq Drives Two-Qubit Gate Accuracy in CMOS to Above 99%
Diraq announced it has successfully demonstrated consistent and repeatable operation with above 99% fidelity of two-qubit gates in the SiMOS (silicon metal-oxide-semiconductor) quantum dot platform.
Inspired by the Human Body, Engineer Designs Chips that Could Make Wearable AI More Energy Efficient
Is it possible to use artificial intelligence tools like ChatGPT without internet access?
xMEMS Introduces 1mm-Thin Active Micro-Cooling “Fan on a Chip”
xMEMS Labs today announced its latest industry-changing innovation: the xMEMS XMC-2400 µCooling chip, the first-ever all-silicon, active micro-cooling fan for ultramobile devices and next-generation artificial intelligence (AI) solutions.
NUS and A*STAR Researchers Develop Wearable, Stretchable Sensor
The novel sensor accurately measures markers such as cholesterol and lactate — crucial for the early detection of diseases.
