Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

GlobalFoundries Acquires Tagore Technology’s GaN Technology

GlobalFoundries today announced that it has acquired Tagore Technology’s proprietary and production proven Power Gallium Nitride (GaN) IP portfolio.

Forge Nano Expands Semiconductor Business

Forge Nano, Inc., an ALD equipment provider and materials science company, today further expanded into the semiconductor market with the unveiling of its new Atomic Layer Deposition (ALD) product offering – TEPHRA – Forge Nano’s new single-wafer, ALD cluster platform.

ClassOne Technology Delivers First Solstice S4 Single-Wafer Processing System to Analog Devices

ClassOne Technology today announced it has delivered the first of two Solstice S4 single-wafer processing systems ordered by Analog Devices, Inc. to its Beaverton, Ore., facility.

Texas Institute for Electronics Announces Executive Board of Directors

Austin-based Texas Institute for Electronics (TIE) announced its executive board of directors.

Multibeam Debuts Semiconductor Industry’s First Multicolumn E-Beam Lithography System for Volume Production

In a milestone for the global semiconductor industry, Multibeam Corp. today introduced the MB platform, a first-of-a-kind Multicolumn E-Beam Lithography (MEBL) system built for mass production.

Micron Releases 2024 Sustainability Report Highlighting Progress and Long-Term Vision

Micron Technology, Inc. today announced the release of its 2024 sustainability report.

Materials Research Revolutionized by a Small Change

POSTECH Professors Daesu Lee and Si-Young Choi develop the next generation of highly efficient memory materials with atom-level control.

Bump Pitch Transformers Will Revolutionize Advanced Packaging

In remarks made in the Keysight Theater at the 61st Design Automation Conference, Dr. Larry Zu, Founder and CEO of Sarcina Technology envisioned new BPT technology paving the way for new artificial intelligence computing opportunities.

Axcelis Expands Semiconductor Equipment Business Operations in Japan

Axcelis Technologies, Inc., a supplier of enabling ion implantation solutions for the semiconductor industry, announced the establishment of new service offices in Chitose, Hokkaido and Kumamoto, Kyushu to support the Company’s expanding customer base in Japan.

Nexperia to Invest $200 Million in Hamburg

Expansion of research & development (R&D) and production capacities for future technologies.