CEA-Leti announced the kick-off meeting today of the FAMES Pilot Line, a pioneering project aimed at advancing semiconductor technologies in Europe.
Silicon Catalyst Ventures Launched to Support Early-stage Semiconductor Startups
Led by a team of seasoned investment and technology experts, in close collaboration with the Silicon Catalyst incubator.
Synopsys Accelerates Chip Innovation with Production-Ready Multi-Die Reference Flow for Intel Foundry
Synopsys, Inc. today announced the availability of its production-ready multi-die reference flow, powered by Synopsys.ai EDA suite, and Synopsys IP for Intel Foundry’s embedded multi-die interconnect bridge (EMIB) advanced packaging technology.
Xpeedic Releases EDA 2024 Platforms
Upgrades solver engines, new features across all fields in advanced packaging, high-speed system, RF system and multi-physics simulation.
Baya Systems and Blue Cheetah Partner to Deliver Chiplet Interconnect Solutions
Baya Systems and Blue Cheetah Analog Design today announced the availability of a combined chiplet-optimized Network on Chip (NoC) and Physical Layer (PHY) interconnect IP solution.
Pearson’s Connections Academy, SEMI Partnership Will Connect Students and Educators to the Semiconductor Industry
Pearson and its Connections Academy, the fully online public school program serving K-12 students, announced today a strategic partnership with the SEMI Foundation, the 501(c)(3) arm of SEMI, a global industry association representing the electronics manufacturing, semiconductor, and design supply chain market.
USTC Integrates Wafer-Scale 2D Materials and Metal Electrodes with van der Waals Contacts
A research team led by Prof. ZENG Hualing, Prof. QIAO Zhenhua, and Prof. SHAO Xiang from the University of Science and Technology of China (USTC) of the Chinese Academy of Sciences (CAS) achieved progress in studying van der Waals (vdW) contacts for two-dimensional (2D) electrical devices.
Breker Readies RISC-V CoreAssurance and SoCReady SystemVIP for Automated, Certification-level RISC-V Verification Coverage
Breker Verification Systems, whose product portfolio solves challenges across the functional and system verification process for large, complex semiconductors, today unwrapped its RISC-V CoreAssurance and SoCReady SystemVIP providing a complete range of automated tests for the entire RISC-V core and SoC verification stack.
Omdia Research Finds Weak Demand Leads to Declining Quarter for Semiconductor Market
In the first quarter of 2024, the semiconductor market experienced approximately 2% decline falling to $151.5bn according to Omdia’s new Competitive Landscaping Tool.
CEA-Leti Scientists Detail Progress on 3D Integration Technologies and Promising Approaches for More Than Moore and RF Integrated Systems at VLSI
CEA-Leti scientists presented three papers at the IEEE Symposium on VLSI Technology and Circuits detailing the institute’s progress on 3D integration technologies, which are a promising approach for designing More than Moore systems, especially radio frequency (RF) integrated systems.
