Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Rice Baker Institute: Coercive Annexation of Taiwan Would Unleash Globally Destructive Consequences

A new paper from Rice University’s Baker Institute for Public Policy argues that an annexation of Taiwan by the People’s Republic of China (PRC) would trigger economic shocks and diminish the quality of life for populations across Asia and beyond, as well as have devastating impacts on American interests and Americans’ well-being.

National Institute for Industry and Career Advancement Announces Launch of Semiconductor Industry Network of Community Colleges

The National Institute for Industry and Career Advancement (NIICA), formerly the National Institute for Innovation and Technology, in partnership with leading community colleges nationwide, has unveiled its Semiconductor Industry Network of Community Colleges (SINC).

SiFive Announces New High-Performance RISC-V Datacenter Processor for Demanding AI Workloads

Today, SiFive, Inc. announced its new SiFive Performance P870-D datacenter processor to meet customer requirements for highly parallelizable infrastructure workloads including video streaming, storage, and web appliances.

New Semiconductor Material: AlYN Promises More Energy-Efficient and Powerful Electronics

Researchers at Fraunhofer IAF have succeeded in growing AlYN/GaN heterostructures in a MOCVD reactor on 4-inch SiC substrates.

Investment Opportunities in the Semiconductor Materials Supply Chain

It’s 2024: the semiconductor industry is experiencing growth driven by AI and leading-edge technology, with demand expected to sharply increase in 2025 as fab expansions ramp.

Veeco Announces Agreement with IBM to Explore Wet Processing Systems for Advanced Packaging Applications

Veeco Instruments Inc. (NASDAQ: VECO) today announced that IBM selected the WaferStorm Wet Processing System for Advanced Packaging applications and has entered into a joint development agreement to explore advanced packaging applications using multiple wet processing technologies from Veeco.

IMAPS 57th International Symposium on Microelectronics Planned for September 30 – October 3, 2024, in Boston

The 57th International Symposium on Microelectronics (IMAPS 2024) will be held September 30 – October 3, 2024, at the Encore Boston Harbor in Boston, Massachusetts. 

AMD Completes Acquisition of Silo AI

AMD today announced the completion of its acquisition of Silo AI, the largest private AI lab in Europe.

Tachyum Builds Last FPGA Prototypes Batch Ahead of Tape-Out

Tachyum today announced the final build of its Prodigy FPGA emulation system in advance of chip production and general availability next year.

Movellus Joins the Silicon Catalyst In-Kind Partner Ecosystem

Movellus today announced that it has joined the Silicon Catalyst ecosystem as the newest member of their In-Kind Partner (IKP) network.