Seoul Semiconductor Co., Ltd., a global opto semiconductor company, accomplished the feat of becoming No. 1 in the global backlight market for the first time.
Finding Pearls in the Mud: Eco-Friendly Tungsten Recovery from Semiconductor Waste
Semiconductor industry waste is typically seen as a costly disposal problem and an environmental hazard. But what if this waste could be transformed into a valuable resource?
Omdia: LTPO OLED Displays Demand for Smartphones to Reach 520 Million Units by 2031
According to new market analysis by Omdia, the shipment volume of LTPO (Low-Temperature Polycrystalline Oxide) OLED displays for smartphones is projected to increase to 520 million units by 2031.
Lithography Materials Headed for Upwards Growth
PFAS elimination efforts expected to drive migration to photoresist alternatives.
Layering Stretchable and Rigid Materials and Incorporating Machine Learning Improves Accuracy of Wearables
A paper published in Device on August 7 outlines how rigid integrated circuits layered on a flexible substrate can be used to improve wearable performance.
‘Amphibious’ Sensors Make New, Waterproof Technologies Possible
Researchers have demonstrated a technique for creating sensors that can function both in air and underwater. The approach paves the way for “amphibious” sensors with applications ranging from wildlife monitoring to biomedical applications.
BrainChip Appoints New CMO, Enhances Scientific Advisory Board
BrainChip Holdings Ltd, the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI, today announced that it has hired Steven Brightfield as its new chief marketing officer and has re-envisioned its Scientific Advisory Board (SAB) by bringing on company founder Peter van der Made, Dr. Jason K. Eshraghian and Dr. André van Schaik.
Entegris Enters Into Long-Term Supply Agreement with onsemi
Entegris, Inc., a supplier of advanced materials and process solutions for the semiconductor and other high-technology industries, announced it has entered into a long-term supply agreement with onsemi, a leading manufacturer of advanced energy-efficient power semiconductors.
ACM Research Strengthens its Fan-Out Panel Level Packaging Portfolio with Launch of Ultra ECP ap-p Tool
ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced its new Panel Electrochemical Plating (Ultra ECP ap-p) tool designed for fan-out panel-level packaging (FOPLP).
New Substrate Material for Flexible Electronics Could Help Combat E-Waste
Electronic waste is a rapidly growing problem, but this degradable material could allow the recycling of parts from many single-use and wearable devices.
