News and Web Editor

Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Design

SEALSQ Launches SEALBOX

SEALSQ Corp today announced the launch of SEALBOX, its innovative solution for IoT device provisioning at the manufacturing level.

Semiconductors

Hitachi High-Tech Launches High-sensitivity and High-throughput Wafer Surface Inspection System

LA9300AD enables detection of shallow microscopic defects, contributing to reduced manufacturing costs and improved yield.

Packaging

Toray Develops Hybrid Bonding Resin for Enhancing Yield and Reliability in Semiconductor Packaging

Toray Industries, Inc., announced today that it has developed an insulating resin material for hybrid bonding (micro bonding).

MEMS

New Study Shows Analog Computing Can Solve Complex Equations and Use Far Less Energy

UMass Amherst research demonstrates that a memristor device can solve complex scientific problems using significantly less energy, overcoming one of the major hurdles of digital computing.

Quantum Experts Join Forces to Revolutionize European Quantum Computing

ORCA Computing, Pixel Photonics, Sparrow Quantum, and the Niels Bohr Institute (NBI) announce their collaboration on the Eurostars project ‘SupremeQ.’

Packaging

Adeia Chooses Veeco to Accelerate Next-Generation Advanced Packaging Applications

Veeco Instruments Inc. today announced that Adeia Inc., a semiconductor R&D innovator has chosen the WaferStorm Wet Processing Systems for advanced packaging applications.

Packaging

Global Semiconductor Materials Market Set to Achieve Record Highs

TECHCET forecasts a rebound in the global semiconductor materials market this year.

Design

Researchers Design New Analog Chip Architecture With High Precision

Design combines the best of digital and analog computing and delivers >10x energy efficiency.

Packaging

Adeia Presents Metrology Techniques for Improved Yield in Hybrid Bonding at IMAPS Device Packaging Conference 2024

Adeia Inc. will showcase the latest developments in hybrid bonding technology at the 20th Annual Device Packaging Conference (DPC 2024) on March 18-21, 2024, at the WeKoPa Resort and Conference Center in Fountain Hills, Arizona

Design

Advancing Toward Wearable Stretchable Electronics

Researchers at Stanford have been working on skin-like, stretchable electronic devices for over a decade.

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