Nova announced today the opening of a new manufacturing facility and office in Germany.
Breakthrough EUV Dry Photoresist Technology from Lam Research Adopted by Leading Memory Manufacturer
Lam Research Corporation today announced that Aether, its innovative dry photoresist technology, has been selected by a leading memory manufacturer as production tool of record for the most advanced DRAM processes.
SIA Applauds House Introduction of Legislation to Strengthen American Chip Manufacturing and Design
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending the introduction in the U.S. House of Representatives of the bipartisan Semiconductor Technology Advancement and Research (STAR) Act.
Forge Nano Triples Semiconductor ALD Tool Production Space with New Cleanroom
Forge Nano, Inc., an atomic layer deposition solution provider, today announced the completion of its new semiconductor cleanroom.
Codasip and RED Semiconductor Sign Memorandum of Understanding to Develop AI Acceleration Technologies
Codasip GmbH and RED Semiconductor International Ltd have signed a Memorandum of Understanding (MoU) to collaborate on developing advanced AI acceleration technologies.
Magnetically Levitated Turbomolecular Pumps for Coating, Research and Industry
EDWARDS VACUUM has developed a new series of magnetically levitated turbomolecular pumps that can withstand the demands of both challenging industrial environments and research processes.
Sunny Stalnaker of ASML to Receive SEMI Sales and Marketing Excellence Award
SEMI today announced that Sunny Stalnaker of ASML has won the 2025 SEMI Sales and Marketing Excellence Award, inspired by Bob Graham.
Applied Labs Raises $4.2M to Make It Easy to Build High Quality AI Support
As businesses struggle with unreliable AI solutions, Scale AI veterans secure seed funding to bring maximum reliability to AI agents in support and operations.
MTR Carbon Capture Selected to Provide a Capture Plant to TSMC
MTR Carbon Capture has been contracted by Taiwan Semiconductor Manufacturing Company (TSMC) to supply a Polaris membrane carbon capture system to treat emissions from a TSMC solvent incineration facility in Taiwan.
SPIE and Boston University Announce $1 Million Endowment for Graduate and Postgraduate Scholarships
SPIE, the international society for optics and photonics, and Boston University (BU) announced the establishment of the SPIE-Boston University Scholarship in Photonics during SPIE Photonics West in San Francisco.
