Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Heraeus Printed Electronics and SUSS MicroTec Announce Joint Development

Heraeus Printed Electronics GmbH and SUSS MicroTec have announced the signing of a Joint Development Agreement to pave the way for digital inkjet printing of metallic coatings for semiconductor manufacturing.

Global Power Semiconductor Market Growth: $55B by 2030

According to Straits Research, “The global power semiconductor market revenue was valued at USD 40 billion in 2020. It is estimated to reach an expected value of USD 55 billion by 2030, registering a CAGR of 3.3 % during the forecast period. (2022-2030).” 

Taalas Raises $50M in Funding

The company is taping out its first large language model chip in the third quarter of 2024 and planning to make it available to early customers in the first quarter of 2025.

SEMI ISS Europe 2024 Opens Tomorrow

Registration is open for the March 6-8 executive conference.

Nomination Period for Phil Kaufman Award and Hall of Fame Open Through June 30

The Phil Kaufman award recognizes individuals whose contributions made significant impacts to electronic system design (ESD) in technology innovation, business, industry direction, education or mentoring.

Scientists Shine New Light on the Future of Nanoelectronic Devices

Researchers develop novel method for studying brain-like circuitry in nanomaterials using Argonne’s Advanced Photon Source.

New Si2 Open Model Interface Provides Standard for Advanced SPICE Capabilities

The Silicon Integration Initiative Compact Model Coalition has released a new version of the Open Model Interface, an Si2 standard, C-language application programming interface that supports SPICE compact model extensions.

SEALSQ to Establish an OSAT Center in Saudi Arabia

SEALSQ Corp. today announced a significant initiative to establish an Open Semiconductors Assembly and Test (OSAT) Center in Saudi Arabia.

Greene Tweed Introduces Fusion F07 Performance-Enhanced FKM for Subfab Exhaust Lines

Greene Tweed, a global manufacturer of high-performance sealing solutions and engineered components, announces the introduction of Fusion F07, a performance-enhanced fluoroelastomer.

SEMI Publishes Priorities on European Economic Security Strategy

SEMI applauded the European Commission for inviting industry feedback as it formulates the European Economic Security Strategy to strengthen Europe’s economic security in the face of ongoing geopolitical tensions and strategic dependencies that characterize the European semiconductor industry.