Shahriar Moinian, distinguished engineer at Broadcom Corp., has won the quarterly Silicon Integration Initiative Pinnacle Award, recognizing volunteers for their exceptional contributions to Si2’s success as a leading semiconductor research and development joint venture.
Electronics Industry Praises U.S. Government Notice of Funding Opportunity for “Advanced Packaging” Technologies
IPC, the global association for electronics manufacturing, praised today’s issuance from the CHIPS for America R&D Office, through the National Institute of Standards and Technology (NIST), of a Notice of Funding Opportunity (NOFO) for research and development activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials.
CHIPS for America Announces Funding Opportunity to Expand U.S. Semiconductor Packaging
Today, the U.S. Department of Commerce issued a Notice of Funding Opportunity (NOFO) to seek applications for research and development (R&D) activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for manufacturing semiconductors.
Wise-integration Raises €15 Million in Series B Funding Round to Support International Growth for Its Innovative GaN Solutions
Wise-integration, a French pioneer in digital control of gallium nitride (GaN) and GaN ICs for power supplies, today announced financing of €15 million.
Silicon Wafers Market – Growth on the Horizon 2024-2028
Wafer shipments expected to pick up in late 2024.
Keysight Introduces Leading Benchmarking Solution to Fast-Track Deployment of Artificial Intelligence Infrastructure
The solution significantly improves benchmarking of new AI infrastructures with unprecedented scale and efficiency.
UAlbany Partners with DeepHow on AI Training for Semiconductor Manufacturing
The University at Albany’s College of Nanotechnology, Science, and Engineering (CNSE) is partnering with software developer DeepHow to adapt and deploy the company’s next-generation artificial intelligence video training platform.
Ancora’s Double Side Cooling GaN-FET Demonstrates Superior Robustness and Long Term Reliability
Ancora Semiconductor Inc. has recently passed a series of rigorous DMTBF (Demonstrated Mean Time Between Failures) tests for its double-sided cooling GaN (Gallium Nitride) field-effect transistor.
Samsung and Nova Publish Joint Research at SPIE Advanced Lithography Conference
The papers will be presented at the SPIE by Nova and Samsung, at the Metrology, Inspection and Process Control conference.
Rinchem Opens Massive Custom Chemical Warehouse in Surprise, Arizona to Support Semiconductor Giant
This facility, boasting 123,516 square feet and 16,000 pallet positions, allows Rinchem to strategically support the booming semiconductor industry in the Phoenix Metro Area.
