By reducing the footprint size to enable a more efficient high-power design, the AONG36322 XSPairFET provides a leading solution for space-constrained DC-DC Buck applications.
Lattice Introduces Advanced 3D Sensor Fusion Reference Design for Autonomous Applications
Lattice Semiconductor, the low power programmable leader, today announced a new 3D sensor fusion reference design to accelerate advanced autonomous application development.
Toshiba Completes New 300mm Wafer Fabrication Facility for Power Semiconductors
Toshiba Electronic Devices & Storage Corporation today held a ceremony to mark the completion of a new 300mm wafer fabrication facility for power semiconductors and an office building at Kaga Toshiba Electronics Corporation in Ishikawa Prefecture, Japan.
ROHM Semiconductor and Nanjing SemiDrive Technology Jointly Develop a Reference Design
ROHM Semiconductor and Nanjing SemiDrive Technology Ltd., China’s largest SoC manufacturer for smart cockpits, today announced they have jointly developed a smart cockpit reference design.
ThinkLabs AI, Inc. Launches and Secures $5M Seed Investment
New startup is developing a digital assistant that leverages a proprietary physics-informed AI digital twin and provides enhanced situational awareness capabilities so control room operators can maintain grid reliability.
Wearable Devices Get Signal Boost from Innovative Material
Rice engineer and collaborators overcome radio frequency performance challenges in skin-interfaced electronics.
Mobix Labs Completes Acquisition of RaGE Systems
RaGE Systems specializes in developing products for 5G communications, mmWave imaging, and Software Defined Radio systems targeting commercial, industrial, defense, and aerospace sectors.
Arctic Semiconductor Announces 3GPP Compliant Platform for 5G Private Networks
Arctic Semiconductor today announced that its low power, high performance 4×4 transceiver IceWings is powering a new small cell platform that has passed 3GPP specification and will soon be available in mass production.
Andes Technology and Arteris Partner To Accelerate RISC-V SoC Adoption
Andes Technology and Arteris partnership aims to support the growing adoption of RISC-V SoCs by mutual customers.
Wise-integration & Leadtrend Technology Introduce GaN System-in-Package
Wise-integration and Leadtrend Technology Corporation, a specialist in analog and analog-digital mixed-mode IC designs, today announced the release of a GaN system-in-package (SiP) supporting consumer electronics applications.
