Vishay Intertechnology, Inc. today announced that its Board of Directors has appointed David McConnell, Senior Vice President -Corporate Treasurer and Risk Management, to the role of Executive Vice President – Chief Financial Officer, replacing Lori Lipcaman who is resigning from that position.
eBeam Initiative Marks 15-Year Anniversary
The eBeam Initiative, a forum dedicated to the education and promotion of new semiconductor manufacturing approaches based on electron beam (eBeam) technologies, today marks its 15-year anniversary at an annual meeting being held in conjunction with the SPIE Advanced Lithography + Patterning Conference in San Jose.
Accellera Systems Initiative Honors Shalom Bresticker with First Distinguished Service Award
Accellera Systems Initiative (Accellera) announced today that Shalom Bresticker, a longtime friend and contributor to Accellera standards efforts, is honored with the first Distinguished Service Award.
Samsung Develops Industry-First 36GB HBM3E 12H DRAM
Samsung Electronics Co., Ltd. today announced that it has developed HBM3E 12H, the industry’s first 12-stack HBM3E DRAM and the highest-capacity HBM product to date.
IDTechEx Discusses Advancing Integration in Antenna Packaging Technologies for 5G and 6G
Millimeter-wave (mmWave), previously confined to military, satellite, and automotive radar applications, has now entered the mobile communications frequency spectrum, offering high data throughput of up to 20 Gbps with an ultralow latency of just 1 ms.
Micron Collaborates with Samsung on Galaxy S24 Series to Unlock the Era of Mobile AI Experiences
Samsung’s flagship Galaxy S24 Ultra, S24+ and S24 incorporate Micron’s high-performance, power-efficient LPDDR5X and UFS 4.0.
Scintil Achieves Integration of III-V DFB Lasers and Amplifiers with Standard Silicon Photonics Technology in Production at Tower Semiconductor
This significant milestone is pivotal in reinforcing Scintil’s supply chain and meeting growing demand for high-performance communication solutions in data centers, artificial intelligence (AI) and 5G networks.
EU Consortium Developing Next-Gen Edge-AI Technologies Is Accepting Design Proposals
A new European Union consortium created to accelerate the development of next-generation, edge-AI technologies is installing cleanroom tools and gearing up to design, evaluate, test and fabricate new circuits from across Europe.
Imec Demonstrates Readiness of the High-NA EUV Patterning Ecosystem
Advances in processes, masks and metrology will enable to fully benefit from the resolution gain offered by the first ASML 0.55NA EUV scanner.
Finwave Semiconductor Showcases Breakthrough Performance Advancement with GaN-on-Silicon Technology at MWC Barcelona 2024
Finwave Semiconductor, Inc. is showcasing its latest technology and products this week at MWC Barcelona.
