Institute’s panel brought together key stakeholders for panel discussion on workforce development in growing semiconductor manufacturing industry, highlights the City of Phoenix’s efforts.
SAPEON Collaborates with DOCOMO Innovations
SAPEON, a global AI semiconductor company, announced their partnership with DOCOMO Innovations, INC. based in Silicon Valley, a subsidiary of Japan’s largest mobile operator, NTT DOCOMO, INC.
Intel Announces New Edge Platform for Scaling AI Applications
The edge-native software platform simplifies development, deployment and management of edge AI applications.
Enhancing Electrogenerated Chemiluminescence of an Iridium Complex
Researchers develop electrogenerated chemiluminescence cells that possess unprecedented levels of luminance and current efficiency.
Micron Commences Volume Production of Industry-Leading HBM3E Solution to Accelerate the Growth of AI
Micron Technology, Inc. today announced it has begun volume production of its HBM3E (High Bandwidth Memory 3E) solution.
U.S. Department of Energy Announces $2.25 Million American-Made SiC Semiconductor Prize Competition
The U.S. Department of Energy’s (DOE) Office of Electricity (OE) today launched the American-Made Silicon Carbide (SiC) Semiconductor Packaging Prize.
Applied Materials Expands Patterning Solutions Portfolio for Angstrom Era Chipmaking
Today at the SPIE Advanced Lithography + Patterning conference, Applied Materials, Inc. introduced a portfolio of products and solutions designed to address the patterning requirements of chips in the “angstrom era.”
Intel Foundry Expands Support for Ansys Multiphysics Signoff Solutions with Intel 18A Process Technology
Intel Foundry certified Ansys (NASDAQ: ANSS) multiphysics solutions for signoff verification of advanced integrated circuits (ICs) designed with the Intel 18A process technology with new RibbonFET transistor technology and backside power delivery.
TSMC’s Kumamoto Plant (JASM) Grand Opening on 24th February
TrendForce’s latest report reveals that in 2023, global foundry revenues hit US$117.47 billion, with TSMC capturing a dominant 60% share.
Mixed-Dimensional Transistors Enable High-Performance Multifunctional Electronic Devices
A research team led by materials scientists from City University of Hong Kong (CityUHK) recently discovered a new strategy for developing highly versatile electronics with outstanding performance, using transistors made of mixed-dimensional nanowires and nanoflakes.
