Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Intrinsic ID Joins Intel Foundry Accelerator IP Alliance to Secure Leading-Edge Semiconductors

Intrinsic ID, the provider of Physical Unclonable Function (PUF) technology field-proven in more than 650 million devices across the globe, today announced that it is now a member of the Intel Foundry Accelerator IP Alliance program to ensure the availability of hardware-based root-of-trust (RoT) solutions for Intel Foundry customers.

Fujitsu Collaborates With QuTech

Fujitsu today announced a collaboration with QuTech for the development of the world’s first cryogenic electronic circuits for controlling diamond-based quantum bits.

SEALSQ Further Expands its Asian Footprint with the Signing of a Distribution Agreement with Okaya

SEALSQ Corp, a company that focuses on developing and selling Semiconductors, PKI and Post-Quantum technology hardware and software products, today announced a Distribution Agreement with Okaya Electronics Corp. (“Okaya”), a leading Japanese semiconductor distributor company headquartered in Tokyo.

IDTechEx Discusses Advanced Semiconductor Packaging Trends in AI and HPC

Advanced semiconductor packaging technologies like 2.5D and 3D hybrid bonding, along with emerging solutions like silicon photonics, are critical in optimizing system performance and fostering the next wave of AI and HPC chip innovation.

Ideal Power Successfully Completes Phase II of Development Program with Stellantis


Ideal Power Inc. today announced the successful completion of Phase II deliverables of a product development agreement with Stellantis, a top 10 global automaker. 

New Omdia Research Shows AI Processors for the Edge Will Nearly Double by 2028

PCs will be the main driver of growth in the AI edge processor market over the next four years, according to new research from Omdia.

STMicroelectronics Expands into 3D Depth Sensing With Latest Time-of-Flight Sensors

The world’s smallest iToF sensor with 672×804-pixel resolution, is now in volume production with a first design win at Lanxin Technology.

ASIP’s OSAT/ATMP Project Launched With Korean JV

Hyderabad based ASIP (Advanced System in Package Technologies) has announced the launch of its project with Korean company APACT Limited as a Joint Venture

Weebit Nano Demonstrates Performance of its ReRAM Under Extended Automotive Conditions

Weebit Nano Limited, a developer of advanced memory technologies for the global semiconductor industry, is demonstrating the high endurance and reliability of its Resistive Random-Access Memory (ReRAM) in extended automotive conditions, including high temperatures of 150 degrees Celsius and extended program cycles.

CEA-Leti Develops Novel Architecture for Keyword-Spotting (KWS) In Always-On, Voice-Activated Edge-AI Systems

CEA-Leti has developed a keyword-spotting system that dramatically improves accuracy in always-on, voice-activated Edge-AI systems and that consumes less power in a far smaller silicon footprint than current technology.