Dr. Sebastian Keckert is awarded this year’s Young Scientist Award for Accelerator Physics by the German Physical Society (DPG).
SEMICON West 2024 to Spotlight U.S. Chip Industry Investments, Supply Chain Resilience, Talent, and Global Growth and Innovation
SEMICON West 2024 will gather industry experts and leaders July 9-11 at the Moscone Center in San Francisco for insights into the latest trends and innovations in sustainability, supply chain management, workforce development and other critical industry issues.
Magnachip Celebrates the Grand Opening of Magnachip Technology Company in China
Magnachip Semiconductor Corporation celebrated the opening ceremony of Magnachip Technology Company, Ltd. yesterday at its headquarters located in Hefei, China.
EV Group Highlights Hybrid Bonding, Maskless Lithography and Layer Transfer Solutions for Heterogeneous Integration at ECTC 2024
Papers to highlight breakthrough capabilities of EVG’s hybrid bonding, LITHOSCALE maskless lithography and IR layer release technology for advanced packaging applications.
Guo Aims at Fundamental Understanding of Emerging Semiconductor Material
NSF provides early career award to support chemist’s research and teaching.
New SEMI University Online Certification Programs to Fast-Track Semiconductor Skills Development
Aiming to help the global semiconductor industry address its talent gap by training and upskilling workers, SEMI today announced that its SEMI University learning platform now offers online course certification programs designed to fast-track semiconductor career development.
Chips Industry May Not Be Fit For Purpose By 2030, Says GlobalData
Next-generation chips represent the next frontier of semiconductor technology, incorporating advancements in design, materials, manufacturing process, performance, and packaging. As computing tasks become more demanding and data-intensive, next-generation chips promise faster speeds and better energy efficiency.
POET Announces Design Win and Collaboration with Foxconn Interconnect Technology
POET and FIT have entered into a collaboration to develop 800G and 1.6T pluggable optical transceiver modules using POET optical engines with an aim to address the growth in demand from cutting-edge AI applications and high-speed data center networks.
Key Measures of Global Semiconductor Manufacturing Industry Strength Improve in Q1 2024, SEMI Reports
The global semiconductor manufacturing industry in the first quarter of 2024 showed signs of improvement with an uptick in electronic sales, stabilizing inventories and an increase in installed wafer fab capacity, SEMI announced today.
Porotech Selects ClassOne Solstice Single-Wafer Platform
ClassOne Technology and Porotech today announced that Porotech has selected the ClassOne Solstice single-wafer platform for the development and manufacture of GaN products for applications requiring silicon wafer substrates.
