Pete Singer

Co-Founder / Editor-in-Chief

346 Articles1 Comments

Pete has over 40 years of publishing experience. He co-founded Semiconductor Digest and the Gold Flag Media company with publisher Kerry Hoffman in 2019. Previously, he spent over 25 years at Semiconductor International and 11 years at Solid State Technology.

Leveraging Visual Data Science in the Semiconductor Manufacturing Industry

“Data, data everywhere.. what am I to think?” This riff on the Rime of the Ancient Mariner may well be the lament of every engineer in the semiconductor industry who feels as if they are drowning in data. Fortunately, new tools are now available that can help.

Apple Is America’s Semiconductor Problem

If Apple wants to source its chips for pennies from foreign suppliers, it should have to pay a price to do so, such as a duty on imported iPhones using only foreign-sourced chips. Realizing the promise of the CHIPS Act depends on acknowledging and addressing Apple’s outsized influence over our domestic chip industry.

MEMS Industry: Poised for a Resilient Comeback?

Despite challenges, the MEMS industry is set for robust growth and technological advancements.

CMOS Image Sensor Industry: A Growing Market with Evolving Technologies

Technological advancements and market dynamics propel the CIS industry forward.

System-Level Simulations, Sub-System Digital Twins, 2.5D Heterogeneous Integration, UCIe and CMOS 2.0

Chip design simulation remains an important tool, but manufacturing and supply chain simulators are equally critical – e.g., digital twins and chiplets. Die hardware integration security looks to be the new threat target for modern systems, and CMOS 2.0 may make the challenge even more significant.

How Etch Breakthroughs Are Tackling 3D NAND Scaling Challenges on the Path to 1,000 Layers

As the industry now looks towards the 1,000-layer roadmap by the end of decade or soon thereafter, there are some critical challenges. Lam is working actively with leading customers to address these in time through innovations in etch, as well as other advanced manufacturing processing steps.

Power SiC WFE Market: Yole Group Forecasts the CapEx Trend

With multiple investments announced by players, the Power SiC wafer front-end equipment market will peak at $5 billion in 2026. Besides the strong growth in the tool market, there are some concerns about future over-capacity and manufacturing challenges for technology transition.

New Processes and Priorities Pose New SubFab Challenges

New process trends are creating new challenges for the equipment in the subfab, particularly vacuum pumps and gas abatements systems that must now handle new types of materials and their process byproducts, and at greater volumes

Wafer Fab Equipment: 2024 Revenue Holds Steady, Poised for 2025 Surge

Yole Group announces a 2024 revenue (calendar year) to increase by 1.3% year-on-year, reaching $108.1 billion, despite a 12% quarter-to-quarter drop in Q1 2024.

Optimizing Risk Mitigation in the Fab and Sub-Fab

Service is starting to come into the risk mitigation category, said Alex Smith, Vice President of Marketing, Semiconductor Service at Edwards.