Using a plasma-based approach, active oxide removal technology empowers 3D chiplet integration and the HBM devices with fine bump pitch roadmaps and new package architectures.
Non-Profit Alliances Boost Chips in Canada
Government aid is forthcoming, but new immigration rules restrict talent.
Cracking the Chip Code to Meet AI’s Growing Demands
For those wishing to push ahead, a heterogeneous system on chip (SoC) is stacked with possibilities.
Managing the Impact of Semiconductor Manufacturers’ Use of Freshwater
Semiconductor companies must set clear goals for reducing freshwater consumption by enhancing efficiency and promoting circularity within their operations.
Navigating the Complexities of Semiconductor Supply Chains Amidst M&A Surge
As M&A reshapes the semiconductor industry, supply chains need to adapt. AI offers solutions that streamline operations, manage part duplications, and improve visibility.
2025: MEMS Leaps Forward
In 2025 and beyond, we can expect to see existing MEMS devices reimagined in new thin-film piezoelectric materials such as scandium aluminum nitride (ScAlN) and lead zirconate titanate (PZT), which will dramatically improve functionality, precision, and durability.
APC-SM Sees Digital Twin Opportunities
Three groups are vying to lead Chips Manufacturing USA institute focused on digital twins.
A Novel New Approach to Acoustic Inspection using SpinSAM Technology
A look at how some of the latest acoustic inspection technology developments and the continued use of AI are addressing the exacting quality control needs of manufacturers.
Introducing 2D-material Based Devices in the Logic Scaling Roadmap
Imec shows a path from planar 2D-FETs to high-performance 2D-CFETs.
Eighteen New Semiconductor Fabs to Start Construction in 2025
The semiconductor industry is expected to start 18 new fab construction projects in 2025. The new projects include three 200mm and fifteen 300mm facilities, the majority of which are expected to begin operations from 2026 to 2027.
