Pete Singer

Co-Founder / Editor-in-Chief

402 Articles1 Comments

Pete has over 40 years of publishing experience. He co-founded Semiconductor Digest and the Gold Flag Media company with publisher Kerry Hoffman in 2019. Previously, he spent over 25 years at Semiconductor International and 11 years at Solid State Technology.

Building Fabs in the U.S. vs Taiwan: Twice as Long, Twice as Much

Construction costs in the U.S., compared to Taiwan, are about twice as much (the process equipment costs are similar). “Building a wafer fab in the west costs twice as much and takes twice the time of building it in Taiwan,” Exyte’s Blaschitz said at SEMI’s ISS.

The High Tech Used to Upskill a High-Tech Workforce

The semiconductor industry is just one example of many industries that stand to benefit from implementing simulation, virtual twin technology into training practices – but it is currently of the most need for change.

Simplifying Technical Documentation for Embedded Systems

By treating documentation generation as a compilation problem and leveraging the power of LLMs within a structured framework, a system can be created to handle the scale and complexity of modern codebases while producing high-quality, consistent, and maintainable documentation.

Leveraging Agile Practices in Chip Design for Enhanced Compliance and Reliability

Implementing practices inspired by Agile way or working into chip design processes offers substantial benefits in enhancing compliance and reliability.

How LTE-M Outperforms Other Technologies in Asset Tracking

The choice of connectivity technology plays a decisive role in the success of tracking assets anywhere in the world.

Modeling Techniques to Speed up Simulation and Emulation in Complex Mixed Signal Devices

A new technique yielded a much better filter response, where the current to charge information was well preserved and also reduced filter complexity. This solution leads to less computations and events for the simulator to process, in turn speeding up the simulation.

Foundries in Europe 2024

Europe will be ready to grow again its market share but should maintain the current status quo and still source about 50% of production abroad.

Enabling HBM 16H Stacks with Residue-Free Fluxless Active Oxide Removal

Using a plasma-based approach, active oxide removal technology empowers 3D chiplet integration and the HBM devices with fine bump pitch roadmaps and new package architectures.

Non-Profit Alliances Boost Chips in Canada

Government aid is forthcoming, but new immigration rules restrict talent.

Cracking the Chip Code to Meet AI’s Growing Demands

For those wishing to push ahead, a heterogeneous system on chip (SoC) is stacked with possibilities.