At SEMICON West 2022, Heidi Van Ee and Darby Brown from the new Digital Solutions business at EMD Electronics spoke to Pete Singer, Editor-in-Chief of Semiconductor Digest about how data analytics is changing the conventional ways of controlling material quality in semiconductor manufacturing.
12 Midwest Institutions Launch Semiconductor-focused Network
A dozen Midwest research colleges and universities that have come together to form a group called the Midwest Regional Network to Address National Needs in Semiconductor and Microelectronics. The goal is to help advance the nation’s strengths in semiconductors and microelectronics.
Intel Signs Agreement with Brookfield to Jointly Invest up to $30 billion in Leading-edge Chip Factories in AZ
Intel announces a first-of-its-kind Semiconductor Co-Investment Program that introduces a new funding model to the capital-intensive semiconductor industry.
The Democratization of Chip Design
The open-source silicon movement with a community-based, open-source platform of easy-to-use, easy-to-access tools is a practical and efficient way to ensure innovation and has the potential to drive exponential semiconductor industry growth.
New Wafer-like and Reticle-like Sensors Deliver Fast, Easy Measurements Inside the Process Chamber
Sensors are available for a range of routine and specialized applications. The two newest sensors offer significant advancements in terms of performance and range of application.
An Interview with Kistler’s Robert Hillinger
Robert Hillinger, Business Development Manager at Kistler, explains how dynamic force measurement increases process reliability in semiconductor production.
Shortages of Equipment, Design Engineers, Face Booming Semiconductor Industry
How to level the playing field with AI software engineers.
Scaling Progress Takes Many Paths at VLSI Symposium
The IEEE 2022 Symposium on VLSI Technology and Circuits attracted 650 people to attend in person in Honolulu, and an equal number of virtual attendees.
Emerging Metrology Requirements for Heterogeneous Integration and 3D Packaging
The ability to speed up the deployment of heterogeneous integration in mass production requires new and more frequent types of measurements in key manufacturing processes, including wafer and die bonding as well as lithography.
Power ICs: A $21B Market Evident in All Applications
Electrification of transport, autonomous driving, batteryfication of power and medical tools, and building and factory automation will continue to drive the market.
