The greatest potential for immediate reductions in GHG emissions in semiconductor manufacturing lies in reducing the energy used by manufacturing equipment.
The Human Hand: Curating Good Data and Creating an Effective Deep-Learning R2R Strategy for High-Volume Manufacturing
Areas ideally suited for AI applications may be repetitive and mental labor-intensive tasks with good available data, or when analytical methods are not applicable or too difficult to find, or data interpolation.
Sony, Samsung, Toshiba, Toppan Have Image Sensor/LiDAR Papers at the VLSI Symposia in June
Since the development of mobile phone camera image sensors, they have been a hot topic with continuous evolution to sub-micron pixels, and more recently the move towards self-driving cars (and other ranging needs) is pushing LiDAR systems.
SEMICON West 2022 Hybrid to Spotlight Sustainability, Smart Technologies, Talent
Sustainability, smart technologies and workforce development will take center stage at SEMICON West 2022 Hybrid, July 12-14 at the Moscone Center in San Francisco, as more than 200 industry leaders, visionaries and technology experts convene
“BEST OF WEST” Deadline Extended
We have extended our submission deadline to Friday, June 10th. Finalists will be announced prior to SEMICON West. The winner will be announced Wednesday, July 13, 2022 at SEMICON West.
Beyond Semiconductor Packaging Materials: Advanced Silicone Solutions
Advanced silicones are enabling semiconductor manufacturers to address a variety of challenges.
Enhancing Performance, Quality and Yield in Current and Emerging Display Technologies
Process metrology, failure analysis, and core-structure characterization can be invaluable in accelerating research and development, enhancing yield and improving display quality.
Sub-fab Improvements Require Reliable Real-time and High Sensitivity In-situ Data
Robust, high speed and high sensitivity real-time data monitoring is essential for enabling rapid response and tight feedback loops.
Semiconductor Time-To-Market Enhanced with Circuit Edit Solutions
New devices will require advanced FIB circuit edit capabilities that empower operation in smaller, higher density areas.
