New processes and materials pose many challenges for supporting vacuum equipment. Intelligent design choices can address these challenges.
North American Semiconductor Equipment Industry Posts July 2021 Billings
North America-based semiconductor equipment manufacturers posted $3.86 billion in billings worldwide in July 2021. The billings figure is 4.5% higher than final June 2021 billings of $3.69 billion and 49.8% higher than July 2020 billings of $2.57 billion.
Semiconductor Packaging Market to Reach $60.44B by 2030
A new report predicts that the global semiconductor packaging market will reach $60.44 billion by 2030 from $27.10 billion in 2020, growing at a CAGR of 9.10% from 2021 to 2030.
Getting the Most Out of Your System
In an article published in the June/July issue of Semiconductor Digest, imec researchers introduce a unique simulation framework. This helps designers manage the complexity of performing cross-‘world’ optimizations – in order to enable the grand applications of the future.
New Insight into Two Widely Accepted Forms of Deep Learning
Experts at BrainChip offered new insights and considerations for the use of transfer learning and incremental learning in edge AI/IoT environments.
Singapore’s Five Research Pillars Outlined at SEMICON Southeast Asia
At SEMICON Southeast Asia 2021, Mr. Terence Gan, SVP, Semiconductors, Economic Development Board (EDB) of Singapore, outlined five research pillars.
JEDEC publishes XFM Embedded and Removable Memory Device Standard
JEDEC announced the publication of JESD233: XFM Embedded and Removable Memory Device (XFMD) standard.
onsemi to Acquire GT Advanced Technologies
ON and GT Advanced Technologies, a producer of SiC, entered into a definitive agreement under which onsemi will acquire GTAT for $415 million in cash.
Mitsubishi Chemical Advanced Materials to Become Climate Neutral By 2023
MCAM has set ambitious targets and actions to reduce its emissions and environmental impact, compensate for unavoidable emissions with high-quality carbon credits, and invest in carbon removal projects
New Plating Tool for WLP and Plating in Compound Semi Manufacturing
ACM’s Ultra ECP GIII plating tool is designed for WLP for compound semiconductors, with product offerings for SiC, GaN and GaAs. The tool is also capable of plating gold into backside deep hole processes with greater uniformity and better step coverage.
