Intel Foundry Services will lead the first phase of the U.S. Department of Defense’s RAMP-C program to establish a domestic commercial foundry infrastructure.
IBM Unveils On-Chip Accelerated Artificial Intelligence Processor
At the annual Hot Chips conference, IBM unveiled details of the upcoming new IBM Telum Processor, designed to bring deep learning inference to enterprise workloads to help address fraud in real-time.
Samsung Brings In-memory Processing Power to Wider Range of Applications
Samsung’s revelations at Hot Chips include the first successful integration of its PIM-enabled High Bandwidth Memory (HBM-PIM) into a commercialized accelerator system, and broadened PIM applications to embrace DRAM modules and mobile memory.
Researchers Just Developed New High-Performance Flexible Electronics
The manufacturing technique invented by the Stanford team makes it possible to create flexible and atomically thin transistors that are several times smaller than previous efforts.
Wooptix Introduces Wafer Geometry System for 300mm Blank Silicon Wafers
Wooptix SL, a Spanish company dedicated to developing new imaging solutions, has introduced Phemet® lab system, a 300mm blank silicon wafer geometry system collecting millions of topography data points on a full wafer in a few seconds.
While Industry Booms, China Worries Mount
While China’s share of all semiconductor production has shot up, the Americas region has declined, raising alarm bells in Washington. “We see a continuation of this trend, with the Americas dropping by one more percent point next year and China building out its lead.” – SEMI senior principal analyst Christian Dieseldorff.
DRAM Prices Move Higher as the Industry Continues to Innovate
A look at current market dynamics and the emergence of DDR5, 1-alpha process node, and CXL. Find the full article in the June/July issue of Semiconductor Digest.
What Trends Will Have the Biggest Impact on Semiconductor Design?
Semiconductor design has progressively improved over the decades, and that will continue for the foreseeable future. Here are some fascinating trends that will likely shape the future of engineering at all stages of product development.
White Paper: Semiconductor Innovation & Intellectual Property Rights
A new white paper from Aalbun, the World’s first Intellectual Property Platform as a Service (PaaS), highlights the big themes and issues dominating the semiconductor industry and how they and the events of the pandemic will impact on innovation and intellectual property rights in the sector going forward.
Graphene Solid State Devices: What Does the Future Hold?
The integration of graphene into the semiconductor industry requires a deep understanding of how this material behaves, how to manipulate it in a fabrication environment and how to employ existing processes to maximise the unique properties of graphene.
