An extreme hypothetical scenario of complete disruption of Taiwanese foundries for one year could cause the global electronics supply chain to come to a halt.
Accelerating AI-Defined Cars
Expect to see a convergence of edge computing, machine vision and 5G-connected vehicles.
IBM Unveils World’s First 2 nm Chip Technology
IBM announced a breakthrough in semiconductor design and process with the development of the world’s first chip announced with 2 nm nanosheet technology. The new design is projected to achieve 45 percent higher performance and 75 percent lower energy use than today’s 7 nm chips. It will likely not be in production until 2024.
Multilayer Thickness Evaluation of Semiconductor and Display Structures by Picosecond Ultrasonics
The product line JAX designed by Neta uses unique properties of femtosecond pulses and photo-acoustic effects to inspect thin films stacks. This 100% non-destructive optical method can be used to test and control multilayers which are typical from applications in the semiconductor or in the display industries.
LiDAR Laser Circuit Optimization and Measurement
A method of measurement is described that provides the necessary feedback to correctly evaluate laser diode and driver performance and changes in spectral response with temperature simultaneously.
Mid-Infrared Optical Metrology for High Aspect Ratio Holes in 3D NAND Manufacturing
Infrared critical dimension metrology (IRCD) addresses the shortcomings of conventional ultraviolet to near-infrared OCD in channel hole etch high-fidelity z-profile and amorphous carbon hardmask etch BCD metrology.
Intel Teams with IBM for Advanced Semiconductor R&D
As Intel expands its domestic manufacturing operations, they will conduct new semiconductor research in advanced semiconductor technology working with IBM’s Albany Semiconductor Research Facility.
TSMC’s Technology Roadmap
Mark Liu, Chairman of Taiwan Semiconductor Manufacturing Company (TSMC), provided detailed insights into the company’s technology roadmap at the recent International Solid-State Circuits Conference (ISSCC). He waved off the suggestion that device technology improvements are slowing down.
New Drivers Propelling Semis, Equipment, IP
The shortage of semiconductors won’t be easy to solve, with some equipment lead times stretching out several years, said VLSI Research CEO Dan Hutcheson at a SEMI event.
Intel Launches ‘IDM 2.0’ Strategy, Including Two New U.S. Fabs and Foundry Services
Intel’s new CEO Pat Gelsinger announced significant manufacturing expansion plans, starting with an estimated $20 billion investment to build two new factories fabs in Arizona. He also announced Intel’s plans to become a major provider of foundry capacity in the U.S. and Europe to serve customers globally.
