Despite challenges, the MEMS industry is set for robust growth and technological advancements.
CMOS Image Sensor Industry: A Growing Market with Evolving Technologies
Technological advancements and market dynamics propel the CIS industry forward.
System-Level Simulations, Sub-System Digital Twins, 2.5D Heterogeneous Integration, UCIe and CMOS 2.0
Chip design simulation remains an important tool, but manufacturing and supply chain simulators are equally critical – e.g., digital twins and chiplets. Die hardware integration security looks to be the new threat target for modern systems, and CMOS 2.0 may make the challenge even more significant.
How Etch Breakthroughs Are Tackling 3D NAND Scaling Challenges on the Path to 1,000 Layers
As the industry now looks towards the 1,000-layer roadmap by the end of decade or soon thereafter, there are some critical challenges. Lam is working actively with leading customers to address these in time through innovations in etch, as well as other advanced manufacturing processing steps.
Power SiC WFE Market: Yole Group Forecasts the CapEx Trend
With multiple investments announced by players, the Power SiC wafer front-end equipment market will peak at $5 billion in 2026. Besides the strong growth in the tool market, there are some concerns about future over-capacity and manufacturing challenges for technology transition.
New Processes and Priorities Pose New SubFab Challenges
New process trends are creating new challenges for the equipment in the subfab, particularly vacuum pumps and gas abatements systems that must now handle new types of materials and their process byproducts, and at greater volumes
Wafer Fab Equipment: 2024 Revenue Holds Steady, Poised for 2025 Surge
Yole Group announces a 2024 revenue (calendar year) to increase by 1.3% year-on-year, reaching $108.1 billion, despite a 12% quarter-to-quarter drop in Q1 2024.
Optimizing Risk Mitigation in the Fab and Sub-Fab
Service is starting to come into the risk mitigation category, said Alex Smith, Vice President of Marketing, Semiconductor Service at Edwards.
KLA: 40 Years of Broadband Plasma Inspection
Broadband plasma inspectors use advanced optical and data processing technologies to discover critical defects on patterned wafers during chip manufacturing.
Bechtel: Now Is the Time for Digital Integration
We recently caught up with Dr. Evann Smith, the digital solutions manager for Bechtel’s Manufacturing & Technology business unit where they lead the strategic development and deployment of the digital ecosystem.
