The technical challenges and advances being realized in modern RF process power systems that make sub 10 nm processing possible are reviewed.
Artificial Intelligence and Machine Learning in Semiconductor Manufacturing: Inspection and Metrology
AI and ML have great potential in many areas of the semiconductor manufacturing process, ranging in scale from improving the performance of individual tools to managing an entire fab and optimizing the global supply chain
The Semiconductor Industry Relies on Fluoropolymers to Power the Modern World
Fluoropolymers are a high performing group of substances with a unique combination of properties that are critical to semiconductor manufacturing but are under threat from misguided and misinformed policies making their way through Washington, D.C., and many states.
Four Tips on The Uses of Electronic Loads
Learn how to test a battery, the transient response of a power supply, a power supply’s ability to limit current, and DC-DC converters.
Redefining Reliability: A Game of Integrity Verification
Four factors lead to device integrity: Correct functional execution, effective infrastructure operation, safe operation in adverse conditions, and secure execution in the face of malicious attack.
Process Power Steps Out from the Shadows
Process power is now providing the most critical knobs enabling plasma processing to deliver increasingly complex three-dimensional features.
Overcoming ALD Limitations to Maximize Manufacturing Precision and Efficiency
How the next generation of ultrahigh-purity ALD valves opens new opportunities.
Wafer Level Packaging Reaches New Heights
Fan-out package revenue is expected to surpass $2B by 2025 and fan-in WLCSP revenue to peak to $3B by 2025 as TSMC continues to drive the fan-out market in 5G applications.
Intel Replaces 10+ with Tweaked SuperFin Technology
Intel held their virtual 2020 Architecture Day on August 13th, hosted by Raja Koduri, and the first major topic was Process Innovations, with Ruth Brain as the presenter. Ruth started with a potted history of Intel processing, from the first strained channel at the 90-nm node to the string of 14-nm evolutions.
Unlocking the Secrets of the YMTC 64-Layer 3D Xtacking® NAND Flash
A look inside YMTC’s second-generation 3D-NAND technology, which uses “Xtacking” to bond the peripheral circuitry face-to-face with the memory array instead of alongside.
