Extending interconnects towards the 3nm technology node and beyond requires several innovations. Imec sees single-print EUV in dual-damascene modules, Supervia structures, semi-damascene modules and added functionality in the back-end-of-line (BEOL) as the way forward.
Harsh New Processes and Materials Pose Challenges for Vacuum Systems
Maximizing the productivity and profitability of the semiconductor manufacturing process requires pump designs that are optimized for the application, especially harsh applications that use condensable or corrosive gases.
Why AIoT is an Essential Element of Continued Technological Innovation
We’re taking a multiplicity of small steps towards a future where AIoT will be deployed widely, in our cars, cities, factories, and stores — and throughout our lives, for the better.
SerDes Designs: Keeping Pace with a Demanding Network Environment
As speed, signal integrity and test boundaries are pushed, cycles of architectural changes and new levels of design innovation for the SerDes chip are only a few of the challenges.
Transitioning to a Circular Economy in Semiconductor Manufacturing
A circular economy is a model for economic activity that is restorative and regenerative by design. This contrasts with the conventional linear model – take, make and waste – that has dominated production design since that advent of the industrial revolution.
Pixel LED Headlights: High Definition Technology Enables New Driving Experiences
LEDS serve as the key technology for the attractive styling of headlights and definition of brand signatures.
Onto Innovation Announces Multiple Orders to Support 5G Ramp
Onto Innovation Inc. (NYSE: ONTO) announced that it has received orders totaling 15 systems from two leaders in advanced packaging. Both customers are ramping up to support the ongoing demand for 5G smartphones which drives advanced packages requiring more precise process control solutions.
Designing and Fabricating Fully-Customized Chips
Silicon chip technology has surprising and largely untapped possibilities for product innovation. But reliably fabricating these specialty chips requires a multidisciplinary team and a robust plan.
A New Wave of Fan-Out Packaging Growth
Key players from different business models are fueling new growth.
The History and Future of DRAM Architecture in Different Application Domains: An Analysis
Common trends and bottlenecks in DRAM architecture are identified.
