A look inside YMTC’s second-generation 3D-NAND technology, which uses “Xtacking” to bond the peripheral circuitry face-to-face with the memory array instead of alongside.
Yes, We CAN Preserve Personal Privacy in Voice-First Consumer Devices
A better balance between cloud and edge processing is a better balance between convenience and privacy, and that’s a win for everyone.
Epitaxy: An Epic Growth
Epitaxy growth equipment for More than Moore devices technology.
VLSI Design Optimization and Validation Process Is Like Painting the Forth Bridge
Some EDA tools have introduced an innovative approach that allows designers to generate design metadata one time for certain verification flows.
Understanding Cooling and Particulate Contamination Challenges for Next Generation ALE Technologies
Mixed-refrigerant Joule-Thomson refrigeration can provide the necessary wafer temperatures and cooling power with smaller footprint, better reliability and lower power consumption than alternative cooling technologies. Cryo-trapping can reduce particle generation by removing the water that mediates the particle formation process.
Building Patterns From The Bottom: A Complementary Approach to Lithography
With shrinking dimensions, the classical lithography-based top-down patterning processes are becoming extremely complex and expensive. Therefore, researchers worldwide are investigating alternative processes allowing to build patterns from the bottom. Two promising approaches are directed self-assembly (DSA) and area-selective deposition (ASD).
Deep Learning at the Extreme Edge: A Manifesto
With continuous voltage and frequency scaling, the logic is self-timed, adjusting core voltage and clock frequency automatically, ensuring no timing violation. This allows the chip to always run the most efficient way for a given workload.
The Chip Wars Get Real
There was a lot of big news in the semiconductor industry during the last week as the U.S., China and Taiwan face off in a chip war over Huawei.
U.S. Targets Huawei’s Chip Supply
The U.S. Department of Commerce announced plans to restrict Huawei’s ability to use U.S. technology and software to design and manufacture its semiconductors abroad.
TSMC to Build and Operate an Advanced Fab in the U.S.
TSMC announced its intention to build and operate an advanced semiconductor fab in Arizona.
