To continue scaling the power density of future semiconductor components, there is no way around 3D integration. Depending on the system requirements, various bonding technologies such as solder connections, thermocompression and hybrid bonding can be selected.
2025: The Increasing Importance of High-Performance Power Management
Power management devices, which include voltage regulators and power converters, are critical components that ensure optimal energy consumption and performance in the most advanced electronic systems, including artificial intelligence (AI) and machine learning.
2025: Power Density and Sustainability Shaping Semiconductor Landscape
As devices become more compact and powerful, traditional packaging methods are no longer sufficient. Techniques such as system-in-package (SiP) and 3D packaging will gain traction, enabling higher performance while minimizing space and volume.
2025: AI Momentum Continues
The optical interposer, which POET pioneered, is gaining traction as a platform technology that can meet the high-volume production requirements of AI clusters while reducing cost and power consumption.
2025: Expanded GEM300 Standard Usage and Cybersecurity
As we look toward 2025, one trend we observe gaining momentum is the increased adoption of GEM300 standards for wafer sizes smaller than 300mm.
2025: Robotics-Driven Automation
Embracing automation will have several benefits for the industry, not the least of which is enabling scalable production solutions that meet the evolving needs of customers during their business cycles.
2025: Sustainability and Photonics
For managing the energy needed for data processing, a key future technology will be silicon photonics, which enables seamless integration of optical components like waveguides, switches, and modulators with electronic circuits on a single silicon chip.
2025: Focus on Integrated Photonics and Chiplets
In the coming year, I expect to see more prototype designs making use of integrated photonics. The demand for better performance is pushing photonic technology toward commercial status and the market is more than ready.
2025: AI, Networking/Communications, Personal Mobility and Aerospace-Defense to Drive Changes
As the heartbeat of intelligent, connected electronics, precision timing will play a key role in 2025’s expansion. Precision timing will drive innovation across industries like healthcare, manufacturing, FinTech, and cybersecurity.
2025: MEMS Move to 300mm
The move to 300mm wafers as a substantial leap forward for the MEMS industry in manufacturing automation and cost-effectiveness, yet many challenges remain.
