At SEMI’s 2020 Industry Strategy Symposium (ISS), held January 12-15th at Half Moon Bay in California, Handel Jones, CEO, International Business Strategies (IBS), spoke on the opportunities and threats in the China market.
ISS: The 2020 Market Outlook
At SEMI’s 2020 Industry Strategy Symposium (ISS), held January 12-15th at Half Moon Bay in California, Bob Johnson, vice president, Gartner, talked about the challenges ahead in the semiconductor market.
Acquisition of Solid State Technology Domain, Contents
I’m delighted to announce that we have successfully acquired the internet domains and content associated with Solid State Technology magazine. We are now working on integrating the well-known electroiq.com and solid-state. com domains into the semiconductor-digest.com family. The content from…
Differential Hall Effect Metrology Enables High Resolution Electrical Property Depth Profiling
Electrical property depth profile data from semiconductor films can be obtained using the Differential Hall Effect Metrology approach. The technique can yield sub-nm depth resolution for Si and Ge. For III-V compounds depth resolution is ~1 nm.
The Holistic Approach to Materials and Processing for New and Scaled Devices
Taking a holistic approach to materials integration considering the subtle effects of seemingly simple materials challenges is required to ensure performance, yield, reliability, and overall cost of ownership.
A Deep Dive into AI Chip Arithmetic Engines
Tesla’s autopilot chip executes 72-trillion additions and multiplications per second: It better get the math right
Revolutionizing Wafer Testing to Bring New Technologies to Market
Nearly every new technology breakthrough in the semiconductor industry targets high volume manufacturing and comes with its unique specificities. This results in challenges for engineers to manufacture and test new integrated circuits (ICs) on the wafer.
Die Crack Detection in HVM is Critical for High Reliability Applications
The detection of cracks after the wafer is diced into individual die has become critical in high reliability applications, like the automotive market, where there are substantial safety and liability concerns.
Building Stronger, Better Designs with DTCO CMP Modeling and Simulation
Predicting CMP damage has always been a part of the manufacturing process, but in a Design-technology co-optimization (DTCO) flow, foundries and EDA companies can work together to automate CMP model building and simulation.
Innovative Approaches to Vacuum Enable High-Volume Atomic Layer Processing
Processes such as atomic layer deposition and etch require fast, repetitive, complete exchange of gases in the process chamber. Vacuum equipment manufacturers have responded with solutions that address the challenges presented by these high flow applications.
