Pete Singer

Co-Founder / Editor-in-Chief

395 Articles1 Comments

Pete has over 40 years of publishing experience. He co-founded Semiconductor Digest and the Gold Flag Media company with publisher Kerry Hoffman in 2019. Previously, he spent over 25 years at Semiconductor International and 11 years at Solid State Technology.

2025: Photonic Integrated Circuits – Driving Quantum Technology

Innovations around photonic integrated circuits (PICs) have the potential to transform our ability to meet the demands of our increasingly data-driven world.

2025: Optimizing Automated Test Equipment for the Era of AI and Beyond

The role of advanced ATE systems will become even more critical; smaller geometries increase test sensitivity requirements, demanding ATE systems with higher precision and accuracy.

2025: Advancements in Litho Technologies Enabling Next-Generation Multi-Chip Systems

As advanced packing gains momentum, the industry will be looking to novel, creative processing solutions to handle the integration imperatives of today – and tomorrow.

2025: The Future is Bright for the Photomask Industry

Increasing investments in critical photomask infrastructure yields benefits for the entire mask-to-wafer ecosystem.

2025: AI is the Driving Force

This year continues to anticipate the impact of AI as the driving force behind optimism in our industry.

2025: New Packaging Approaches Drive Cost and Efficiency

The fast adoption of chiplets will continue to drive wafer-level packaging (WLP) growth in 2025, as semiconductor companies continue to invest in various types of packages for diverse applications.

2025: Opportunities Abound for Semiconductor Equipment

As we look ahead to 2025, we’re seeing three major trends: a growing compound semiconductor market, the resurgence of wet bench technology and growing workforce development needs.

2025: A Paradigm Shift in Wire Interconnection

The drive towards high density (HD), ultra-high density (UHD) and alternative substrates, including glass, will be transformative for North American wire interconnection manufacturing in 2025.

2025: The Future of Flex Is Here

A rapidly accelerating trend is the proliferation of complex assembly directly onto flexible substrates.

2025: Power Efficiency and Computational Flexibility in AI/ML Processors

Compression, especially after quantization, can help reduce the bandwidth and large storage required by model weights, thereby reducing power consumption.