The optical interposer, which POET pioneered, is gaining traction as a platform technology that can meet the high-volume production requirements of AI clusters while reducing cost and power consumption.
2025: Expanded GEM300 Standard Usage and Cybersecurity
As we look toward 2025, one trend we observe gaining momentum is the increased adoption of GEM300 standards for wafer sizes smaller than 300mm.
2025: Robotics-Driven Automation
Embracing automation will have several benefits for the industry, not the least of which is enabling scalable production solutions that meet the evolving needs of customers during their business cycles.
2025: Sustainability and Photonics
For managing the energy needed for data processing, a key future technology will be silicon photonics, which enables seamless integration of optical components like waveguides, switches, and modulators with electronic circuits on a single silicon chip.
2025: Focus on Integrated Photonics and Chiplets
In the coming year, I expect to see more prototype designs making use of integrated photonics. The demand for better performance is pushing photonic technology toward commercial status and the market is more than ready.
2025: AI, Networking/Communications, Personal Mobility and Aerospace-Defense to Drive Changes
As the heartbeat of intelligent, connected electronics, precision timing will play a key role in 2025’s expansion. Precision timing will drive innovation across industries like healthcare, manufacturing, FinTech, and cybersecurity.
2025: MEMS Move to 300mm
The move to 300mm wafers as a substantial leap forward for the MEMS industry in manufacturing automation and cost-effectiveness, yet many challenges remain.
2025: Photonic Integrated Circuits – Driving Quantum Technology
Innovations around photonic integrated circuits (PICs) have the potential to transform our ability to meet the demands of our increasingly data-driven world.
2025: Optimizing Automated Test Equipment for the Era of AI and Beyond
The role of advanced ATE systems will become even more critical; smaller geometries increase test sensitivity requirements, demanding ATE systems with higher precision and accuracy.
2025: Advancements in Litho Technologies Enabling Next-Generation Multi-Chip Systems
As advanced packing gains momentum, the industry will be looking to novel, creative processing solutions to handle the integration imperatives of today – and tomorrow.
