Pete Singer

Co-Founder / Editor-in-Chief

419 Articles1 Comments

Pete has over 40 years of publishing experience. He co-founded Semiconductor Digest and the Gold Flag Media company with publisher Kerry Hoffman in 2019. Previously, he spent over 25 years at Semiconductor International and 11 years at Solid State Technology.

New Processes and Priorities Pose New SubFab Challenges

New process trends are creating new challenges for the equipment in the subfab, particularly vacuum pumps and gas abatements systems that must now handle new types of materials and their process byproducts, and at greater volumes

Wafer Fab Equipment: 2024 Revenue Holds Steady, Poised for 2025 Surge

Yole Group announces a 2024 revenue (calendar year) to increase by 1.3% year-on-year, reaching $108.1 billion, despite a 12% quarter-to-quarter drop in Q1 2024.

Optimizing Risk Mitigation in the Fab and Sub-Fab

Service is starting to come into the risk mitigation category, said Alex Smith, Vice President of Marketing, Semiconductor Service at Edwards.

KLA: 40 Years of Broadband Plasma Inspection

Broadband plasma inspectors use advanced optical and data processing technologies to discover critical defects on patterned wafers during chip manufacturing.

Bechtel: Now Is the Time for Digital Integration

We recently caught up with Dr. Evann Smith, the digital solutions manager for Bechtel’s Manufacturing & Technology business unit where they lead the strategic development and deployment of the digital ecosystem.

Edwards: How Cryogenics and High-Speed Vacuum Pumps Enable High Aspect Ratio Etch

Edwards has a new cryogenic chiller called Polycold that provides cryogenic wafer chuck cooling. The company also announced a new line of turbopumps.

SCREEN Focuses on Sustainability, New Coat/Develop Track Systems

SCREEN offers a diverse range of systems, from its flagship models for 300mm wafers, offering high functionality and superior productivity for the cutting-edge device market, to 200mm and under models that handle wafers of various sizes and shapes for the IoT device market

How to Solve Top ALD and ALE Semiconductor Processing Challenges

The key to precisely controlling the chemicals used in ALD and ALE during the thousands of “on and off” steps to deposit or etch one layer is the valve design.

Managing Complex Logistics in Today’s Semiconductor Industry

The complexity of the semiconductor manufacturing process is well known, but the logistics of supplying a megafab with equipment and materials can be equally complex. Delivering just one EUV lithography tool, for example, takes three Boeing 747 cargo planes, 40 freight containers and 20 trucks.

The Impact of AI and ML on Embedded Systems

AI and ML are fundamentally reshaping the landscape of embedded technology by enabling these devices to learn from data, make intelligent decisions, and adapt to their surroundings.