An ultra-low power hybrid chip inspired by the brain could help give palm-sized robots the ability to collaborate and learn from their experiences. Combined with new generations of low-power motors and sensors, the new ASIC could help intelligent swarm robots operate for hours instead of minutes.
AI
Renesas Electronics Develops New Processing-In-Memory Technology for Next-Generation AI Chips
Renesas Electronics Corporation (TSE: 6723), a supplier of advanced semiconductor solutions, today announced it has developed an AI accelerator that performs CNN (convolutional neural network) processing at high speeds and low power to move towards the next generation of Renesas embedded AI (e-AI), which will accelerate increased intelligence of endpoint devices. A Renesas test chip featuring this accelerator has achieved the power efficiency of 8.8 TOPS/W (Note 1), which is…
CEA-Leti Announces Smart-Farm Project to Lower Greenhouse Gas Emissions & Boost Farming Efficiency
Leti, a research institute of CEA Tech, today announced a new European Commission smart-farming project that will deliver real-time data on soil conditions.
Deployed via small, private Internet of Things networks, the SARMENTI sensor node will provide farmers with the next generation of a reagent-free sensor platform to monitor in real-time soil nutrient concentration and measure local environmental conditions, especially emission of ammonia and greenhouse gases.
Call For SEMICON WEST 2019 “Best Of West” Award Applications
SEMI is accepting SEMICON West 2019 exhibitor applications for the Best of West award recognizing innovative new products or services that are significantly advancing the electronics manufacturing supply chain or a particular manufacturing capability. The application deadline for the Best of West award, presented annually by Semiconductor Digest magazine and SEMI Americas, is June 14. Exhibitors can apply using the online submission form. Best of West award winners will be announced July 10 at SEMICON West 2019, July…
Semiconductor Leaders Strike Agreement on Global Policy Agenda
The Semiconductor Industry Association welcomed a policy agreement reached by global semiconductor industry leaders at the 23rd annual meeting of the World Semiconductor Council this week in Xiamen, China.
IEEE International Electron Devices Meeting Announces 2019 Call for Papers
The 65th annual IEEE International Electron Devices Meeting(IEDM), to be held at the Hilton San Francisco Union Square hotel December 7–11, 2019, has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research and development. The paper submission deadline this year is Friday, July 26, 2019. Authors are asked to submit four-page camera-ready papers. Accepted papers will be published as-is in the proceedings. Only a very small…
USC ISI and Intel Custom Foundry Collaborate to Spur Microelectronics Innovation
USC Viterbi’s Information Sciences Institute (ISI) and the Intel Corporation’s custom foundry organization today announced a collaboration to design, fabricate and package integrated circuits (ICs) through USC ISI’s MOSIS unit. The collaboration combines MOSIS’s industry-leading integrated circuit manufacturing expertise with Intel’s high-performance complementary metal-oxide semiconductor (CMOS) fabrication and packaging technology. It positions ISI and Intel Custom Foundry (ICF) to lead a new era of high-performance microelectronic manufacturing for the U.S. and global IC…
Sensors/Actuators Reach Record Sales on Slower Growth
After two strong years, the sensor and actuator market has cooled off as a result of inventory drawdowns, slowing unit shipments, and economic uncertainty, says report.
SEMI Spring Washington Forum – Connecting Members with Policymakers at a Critical Time
Tensions between the United States and China have reached fever pitch. Ongoing trade negotiations between the U.S. and China broke down earlier this month over reported backpedaling by China on key concessions in a proposed Trump administration deal.
Audi First Carmaker To Join SEMI
SEMI, the industry association serving the global electronics manufacturing and design supply chain, announced that AUDI AG, a leading German manufacturer of luxury vehicles, has become the first automotive OEM to join SEMI. SEMI membership will give Audi access to SEMI core competencies in developing international standards and harmonizing technology roadmaps and enable the automaker to leverage the global SEMI platform to promote industry alignment across supply-chain segments. Audi is a…
