Ansys today announced it is integrating the NVIDIA Modulus AI framework into Ansys semiconductor simulation products to deliver AI functionality that significantly speeds up design optimization.
AI
The 2024 MRAM Global Innovation Forum Showcases the Latest Innovations, Advances, and Research Findings in MRAM Technology
The MRAM Global Innovation Forum is the industry’s premier platform that brings together leading magnetics experts, researchers, and industry professionals to share the latest advancements in Magnetoresistive Random Access Memory (MRAM) technology.
C-Hawk Technology Pioneers Robotic Plastic Welding with New Roberto Platform for Semiconductor Equipment Manufacturing
C-Hawk Technology announced its new patent-pending Roberto platform, an integrated robotics system that automates plastic welding and sets new benchmarks for quality, precision, scalability and safety in manufacturing for plastic welded assemblies and subassemblies.
Sagence AI Emerges from Stealth Tackling Economic Viability of Inference Hardware for Generative AI
Sagence AI today emerged from stealth unveiling a groundbreaking advanced analog in-memory compute architecture that directly addresses the untenable power/performance/price and environmental sustainability conundrum facing AI inferencing.
Applied Materials Announces New Collaboration Model for Advanced Packaging at Summit on Energy-Efficient Computing
Company convenes top semiconductor R&D leaders to advance high-performance, low-power AI chip packaging technologies.
TetraMem Inc and SK hynix Announce Research Partnership
Today, TetraMem Inc & SK hynix Inc announced that they have signed an SOW outlining their partnership on a joint research project to advance the promise of in-memory computing (IMC) for AI applications.
NVIDIA Accelerates Google Quantum AI Processor Design With Simulation of Quantum Device Physics
NVIDIA today announced it is working with Google Quantum AI to accelerate the design of its next-generation quantum computing devices using simulations powered by the NVIDIA CUDA-Q platform.
xMEMS Active Micro-Cooling “Fan on a Chip” Named as CES Innovation Awards 2025 Honoree
The recently announced xMEMS XMC-2400 µCooling chip, the first-ever all-silicon, active micro-cooling air pump for small, thin electronics devices and next-generation artificial intelligence (AI) solutions, has been named a CES Innovation Awards 2025 Honoree in the best in computer hardware and components category.
NVIDIA’s AI-Driven Triumph Over Intel Powered by Strategic Innovations, GlobalData Reveals
In a historic shift, NVIDIA has taken Intel’s coveted spot on the Dow Jones Industrial Average.
Microchip to Accelerate Real-time Edge AI with NVIDIA Holoscan
To enable developers building artificial intelligence (AI)-driven sensor processing systems, Microchip Technology has released its PolarFire FPGA Ethernet Sensor Bridge that works with the NVIDIA Holoscan sensor processing platform.
