To address the limitations of analog hardware memory devices, the research team focused on Electrochemical Random Access Memory (ECRAM), which manage electrical conductivity through ion movement and concentration.
AI
Researchers Develop Device to Make Artificial Intelligence More Energy Efficient
Energy consumption from artificial intelligence could be reduced by a factor of at least 1,000 with this device.
Fractile Raises $15M Seed Funding
Fractile, a UK company building a groundbreaking new AI chip to deliver exponential performance improvements for AI models, has today exited stealth and announced $15m (£12m) in seed funding.
Analog Devices and Flagship Pioneering Announce Strategic Partnership
Analog Devices, Inc. (Nasdaq: ADI), a global semiconductor leader, and Flagship Pioneering, the bioplatform innovation company, today announced a strategic alliance to accelerate the development of a fully digitized biological world.
IEEE Leaders Reveal Top Three Technology Megatrends Driving the Need to Upskill and Reskill Employees
2024 Technology Megatrends predicted to boost productivity and future-proof the global workforce are Artificial General Intelligence, Digital Transformation, and Sustainability.
SiMa.ai and Ortecs Announce Agreement to Deliver Edge AI Technology in Israel
Through its partnership with SiMa.ai, Ortecs will expand its portfolio and provide its customers and the market in Israel with a new artificial intelligence offering.
Lam Research Appoints Ava Harter as Chief Legal Officer
Lam Research Corp. today announced that Ava Harter has joined its executive leadership team as senior vice president and chief legal officer.
Nanotronics Unveils Gen V AI Model and Two New, Affordable Inspection Products
Nanotronics is set to redefine industry standards with the introduction of its next generation AI, and two new hardware products that leverage it.
JEDEC Approaches Finalization of HBM4 Standard
JEDEC Solid State Technology Association today announced it is nearing completion of the next version of its highly anticipated High Bandwidth Memory (HBM) DRAM standard: HBM4.
AEM Introduces the New Generation of Automated Burn-In Systems for AI and High Performance Compute Chip Testing
AEM announced today the launch of a new burn-in capability for its high-parallel test platform, AMPS.
