Microchip Technology has acquired Neuronix AI Labs to expand its capabilities for power-efficient, AI-enabled edge solutions deployed on field programmable gate arrays (FPGAs).
AI
A Novel Machine Learning Model for the Characterization of Material Surfaces
Machine learning (ML) enables the accurate and efficient computation of fundamental electronic properties of binary and ternary oxide surfaces, as shown by scientists from Tokyo Tech.
Semiconductor Research Corporation Announces 2024 Call for Research, $13.8M in Funding Opportunities
Semiconductor Research Corporation (SRC) is announcing the start of solicitation season with $13.8 million in funding opportunities.
SEMI University Launches In-Person Courses to Help Semiconductor Industry Workforce Build Skills
Aiming to help the global semiconductor workforce expand its skills to address the talent gap, SEMI today announced the expansion of the SEMI University learning platform to include in-person trainings.
Global Semiconductor Sales Increase 16.3% Year-to-Year in February
Year-to-year market growth in February is largest since May 2022; worldwide chip sales decrease 3.1% month-to-month.
Lambda Announces $500M GPU-Backed Facility to Expand Cloud for AI
Lambda, the GPU cloud company founded by AI engineers and powered by NVIDIA GPUs, today announced that it has secured a special purpose GPU financing vehicle of up to $500 million to fund the expansion of its on-demand cloud offering.
SiMa.ai Secures Funds and Readies New Generative Edge AI Platform
SiMa.ai, the software-centric, embedded edge machine learning system-on-chip company, today announced it has raised an additional $70M of funding led by Maverick Capital, with participation from Point72 and Jericho, as well as existing investors Amplify Partners, Dell Technologies Capital, Lip-Bu Tan and others.
SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana
SK hynix Inc. announced today that it will invest an estimated $3.87 billion in West Lafayette, Indiana to build an advanced packaging fabrication and R&D facility for AI products.
Aspinity Establishes Technical Advisory Board
Aspinity today announced the formation of its technical advisory board, including Kymeta President and CEO Rick Bergman and Boston Consulting Group (BCG) Advisor Bill Earnshaw.
Henkel Semiconductor Capillary Underfill Enables AI and Advanced Packaging Designs
Henkel today announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements of the market’s most demanding advanced packages, like those used in artificial intelligence (AI) and high-performance computing (HPC) applications.
