Approximate $7 billion investment over the next several years to meet AI data center demand.
AI
Introducing 2D-material Based Devices in the Logic Scaling Roadmap
Imec shows a path from planar 2D-FETs to high-performance 2D-CFETs.
Aledia Unveils Breakthrough MicroLED Technology at CES 2025
At CES 2025, Aledia today unveiled the availability of its game-changing microLED technology set to redefine the future of hardware for augmented reality and to power the next generation of displays for vision applications.
Eighteen New Semiconductor Fabs to Start Construction in 2025
The semiconductor industry is expected to start 18 new fab construction projects in 2025. The new projects include three 200mm and fifteen 300mm facilities, the majority of which are expected to begin operations from 2026 to 2027.
Applying Visual Data Science and AI to Solve Complex Manufacturing Challenges
Spotfire’s immersive analytics experience aligns with natural human interactions, offering features like AI-powered recommendations, real-time data integration, and intuitive visual manipulation.
2025: A Blend of Challenges and Opportunities
The semiconductor industry remains a dynamic landscape, propelled by technical advancements and shifting market demands.
AI Slashes Cost and Time for Chip Design, But That’s Not All
Researchers at Princeton Engineering and the Indian Institute of Technology have harnessed artificial intelligence to take a key step toward slashing the time and cost of designing new wireless chips and discovering new functionalities to meet expanding demands for better wireless speed and performance.
2025 Outlook: Executive Viewpoints
Each year, Semiconductor Digest turns to industry leaders and analysts to get their viewpoints on what they expect to see in the coming year in terms of critical tech and business trends.
2025: Navigating Shifts in Semiconductor Demand
I would expect numbers for wafer fab equipment (WFE) to be between 5% and 10% growth, reaching the low $100 billions for 2025.
2025: AI, Device Complexity Will Continue to Drive Packaging and Test Demands
The products used to power today’s AI/ML applications are far more complex than anything our industry has seen before.
