INFICON announced the launch of a new global Data Science Team to centralize and expand its AI-focused initiatives in the Smart Manufacturing space.
AI
Micron Introduces World’s Fastest, Most Energy Efficient 60TB SSD
Micron Technology, Inc. today announced it has begun qualification of the 6550 ION NVMe SSD with customers.
SEMICON Europa 2024 Opens Tomorrow to Highlight Innovation and Collaboration Powering Sustainable Growth
SEMICON Europa 2024 opens tomorrow at Messe München in Munich, Germany, convening industry leaders from across the electronics design and manufacturing supply chain to exchange insights on the advancements and trends driving sustainable growth in the semiconductor sector.
Tenstorrent Expands Deployment of Arteris’ Network-on-Chip IP to Next-Generation of Chiplet-Based AI Solutions
Arteris’ FlexNoC interconnect IP optimizes the on-chip communication flow supporting superior performance, power and area for advancing AI chip and chiplet computing.
DENSO and U.S. Startup Quadric Sign Development License Agreement for AI Semiconductor
DENSO CORPORATION and Quadric.inc have signed a development license agreement for a Neural Processing Unit (NPU), which is a semiconductor specialized for the arithmetic processing of AI.
Towards Implementing Neural Networks on Edge IoT Devices
Researchers propose a novel magnetic RAM-based architecture that leverages spintronics to realize smaller, more efficient AI-capable circuits.
Tech and Talent to Supercharge the Semiconductor Industry
New CHIPS and Science Act funding supports Arizona State University efforts to create an ultra-energy-efficient chip and fill microelectronics workforce shortages.
EV Group Announces Management Board Expansion In Light Of Unabated Growth
EV Group (EVG), a provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today announced the expansion of its management board.
GlobalFoundries and NXP to Deliver Next-Generation 22FDX Solutions for Automotive, IoT and Smart Mobile
Building on years of collaboration, this new process technology collaboration will provide power-efficient and secure connectivity solutions for essential consumer and industrial applications manufactured both in Europe and the U.S.
HKU Engineering Team Develops Soft Microelectronics Technologies Enabling Wearable AI for Digital Health
Leveraging rapid technological advances for human health is a global trend, driving the rise of biomedical engineering research. A fast-rising field is wearable biosensors, which have the potential to realise digital healthcare and AI medicine.
