New electromyography (EMG) sensor technology that allows the long-term stable control of wearable robots and is not affected by the wearer’s sweat and dead skin has gained attention recently.
AI
SEMICON Korea 2024 Opens Tomorrow to Spotlight Chip Industry Innovation and Growth Opportunities
With the rise of generative AI driving demand for advanced chips and memory semiconductors to process and store massive amounts of data, the stage is set for SEMICON Korea 2024, opening tomorrow at COEX in Seoul to highlight innovations shaping the future.
Arteris Selected by Rain AI for Use in the Next Generation of AI
Optimizing on-chip mesh connectivity with Arteris’ FlexNoC 5 physically aware network-on-chip enables Rain AI to realize faster data transfers at ultra-low power to achieve record performance for Generative AI and Edge AI computing at scale.
Utilizing Active Microparticles for Artificial Intelligence
Physicists at Leipzig University have now created a type of neural network that works not with electricity but with so-called active colloidal particles.
Semiconductor Tech Received Most Granted Patents in 2023
An annual analysis of publicly available patent data from IP management firm Anaqua found that semiconductor technologies received the most granted patents in the US in 2023, the second year in a row that semiconductors have topped the list.
Saras Micro Devices Opens New HQ in AZ
The company seeks to support and leverage growing semiconductor and advanced packaging ecosystem in the region
Archer Materials Reports Progress on Quantum Processor Chip and Biochip
Archer Materials, a semiconductor company advancing the quantum computing and medical diagnostics industries, recently provided its quarterly update for Q2 FY24.
Supercomputer Heads into Space
Expanding its venture into space computing, Hewlett Packard Enterprise (HPE) will launch an updated HPE Spaceborne Computer-2 to the International Space Station (ISS).
Demand for AI-Optimized Chipsets to Spur Requirements for Hybrid Bonding
Compared with other methods, hybrid bonding offers inherent advantages in high-density IO (input- output), reduced parasitic delay, shorter height and improved thermal performance.
EdgeCortix Predicts Next-Gen AI Will Start to Revolutionize Business in 2024
EdgeCortix, the Japan-based fabless semiconductor company focused on energy-efficient AI processing, predicts that 2024 is set to be a watershed moment for Edge AI.
