Dell’Oro projects the accelerator market is on track to surpass the CPU market in revenues by nearly two-fold in 2023.
AI
Senate Unanimously Confirms Michelle Giuda as Member of Bipartisan Board to U.S. Agency for Global Media
The Krach Institute for Tech Diplomacy at Purdue announced today that its CEO, Michelle Giuda, has been unanimously confirmed by the U.S. Senate to serve on the newly formed bipartisan International Broadcasting Advisory Board.
AI: The Rise Beyond Physical Boundaries
Researchers achieve the world’s first direct physical application of AI in which it beats humans.
Keeping the Pace of Moore’s Law through Industry Collaboration
It’s no secret: the semiconductor industry is at a crossroads.
SEMICON Japan 2023 Opens Tomorrow to Showcase Smart Data-AI, Smart Mobility, Sustainability, Advanced Packaging, Talent
SEMICON Japan, the largest and most influential gathering of the microelectronics manufacturing supply chain in Japan, opens tomorrow at Tokyo Big Sight with more than 900 exhibitors from 19 regions showcasing their latest products and technologies.
Global Semiconductor Alliance Announces Winners of 2023 GSA Awards
Last night, the Global Semiconductor Alliance (GSA) celebrated the achievements of remarkable individuals and exceptional semiconductor companies at its annual GSA Awards Ceremony gala. Join us in congratulating this year’s recipients.
Thermal Impact of 3D Stacking Photonic and Electronic Chips
Researchers investigate how the thermal penalty of 3D integration can be minimized.
Micron Unveils Client SSD to Fuel Demanding PC Applications
Micron Technology, Inc. today announced it is shipping the Micron 3500 NVMe SSD, which leverages its 232-layer NAND to power demanding workloads for business applications, scientific computing, cutting-edge gaming and content creation, pushing the limits of what is possible.
Brainstorming With a Bot
CFN’s Kevin Yager develops a chatbot with an expertise in nanomaterials.
2D Material Reshapes 3D Electronics for AI Hardware
Researchers demonstrated monolithic 3D integration of layered 2D material into novel processing hardware for artificial intelligence computing. The new approach provides a material-level solution for fully integrating many functions into a single, small electronic chip — and paves the way for advanced AI computing.
