It’s no secret: the semiconductor industry is at a crossroads.
AI
SEMICON Japan 2023 Opens Tomorrow to Showcase Smart Data-AI, Smart Mobility, Sustainability, Advanced Packaging, Talent
SEMICON Japan, the largest and most influential gathering of the microelectronics manufacturing supply chain in Japan, opens tomorrow at Tokyo Big Sight with more than 900 exhibitors from 19 regions showcasing their latest products and technologies.
Global Semiconductor Alliance Announces Winners of 2023 GSA Awards
Last night, the Global Semiconductor Alliance (GSA) celebrated the achievements of remarkable individuals and exceptional semiconductor companies at its annual GSA Awards Ceremony gala. Join us in congratulating this year’s recipients.
Thermal Impact of 3D Stacking Photonic and Electronic Chips
Researchers investigate how the thermal penalty of 3D integration can be minimized.
Micron Unveils Client SSD to Fuel Demanding PC Applications
Micron Technology, Inc. today announced it is shipping the Micron 3500 NVMe SSD, which leverages its 232-layer NAND to power demanding workloads for business applications, scientific computing, cutting-edge gaming and content creation, pushing the limits of what is possible.
Brainstorming With a Bot
CFN’s Kevin Yager develops a chatbot with an expertise in nanomaterials.
2D Material Reshapes 3D Electronics for AI Hardware
Researchers demonstrated monolithic 3D integration of layered 2D material into novel processing hardware for artificial intelligence computing. The new approach provides a material-level solution for fully integrating many functions into a single, small electronic chip — and paves the way for advanced AI computing.
Vertiv Collaborates with Intel on Liquid Cooled Solution for the Intel Gaudi3 AI Accelerator Platform
Intel’s next-generation AI accelerators will be supported by Vertiv liquid-cooled data center infrastructure solutions to help organizations accelerate AI adoption while achieving sustainability goals.
What’s in the November/December Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the November/December issue.
Untether AI Joins UCIe Consortium to Drive Chiplet Technology and Energy-Centric AI Acceleration
Untether AI today announced that it has joined Universal Chiplet Interconnect Express (UCIe) Consortium, the industry organization that has developed an open specification that defines the interconnect between chiplets within a package.
