Winbond Electronics Corporation, a global supplier of semiconductor memory solutions, has unveiled a powerful enabling technology for affordable Edge AI computing in mainstream use cases.
AI
Synopsys and TSMC Advance Analog Design Migration with Reference Flow Across Advanced TSMC Processes
Synopsys, Inc. today announced its analog design migration flow is enabled across TSMC’s advanced process technologies, including N4P, N3E, and N2.
Deputy Secretary of Defense Kathleen Hicks Announces $238M CHIPS and Science Act Award
Deputy Secretary of Defense Kathleen Hicks announced the award today of $238 million in “Creating Helpful Incentives to Produce Semiconductors (CHIPS) and Science Act” funding for the establishment of eight Microelectronics Commons (Commons) regional innovation hubs.
ITRI Leads Global Semiconductor Collaboration for Heterogeneous Integration to Pioneer Pilot Production Solutions
The introduction of Generative AI (GAI) has significantly increased the demand for advanced semiconductor chips, drawing increased attention to the development of complex calculations for large-scale AI models and high-speed transmission interfaces.
Aspinity Raises $5 Million Series B Funding to Bring Breakthrough AI/ML Technology to a Global Market
Aspinity today announced that it has closed $5 million in Series B funding from current investors Anzu Partners, Birchmere Ventures, Mountain State Capital and Riverfront Ventures.
Intel Unveils Industry-Leading Glass Substrates to Meet Demand for More Powerful Compute
Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers and AI products.
Empire State Development Announces Application Window is Now Open for Luminate NY Accelerator and Business Competition
Empire State Development (ESD) today announced that Luminate NY—the world’s largest business accelerator for startup companies that have optics, photonics, and imaging (OPI) enabled technologies—is now accepting applications for its seventh cohort.
Cadence Accelerates On-Device and Edge AI Performance and Efficiency with New Neo NPU IP and NeuroWeave SDK for Silicon Design
Cadence Design Systems, Inc. today unveiled its next-generation AI IP and software tools to address the escalating demand for on-device and edge AI processing.
Microchip Teams Up with Intelligent Hardware Korea
To address the rapid rise of Artificial Intelligence (AI) computing at the edge of the network and its associated inferencing algorithms, Intelligent Hardware Korea (IHWK) is developing a neuromorphic computing platform for neurotechnology devices and field programmable neuromorphic devices.
Synopsys Extends Synopsys.ai EDA Suite with Industry’s First Full-Stack Big Data Analytics Solution
Synopsys, Inc. (Nasdaq: SNPS) today announced the extension of its Synopsys.ai full-stack EDA suite with a comprehensive AI-driven data analytics continuum for every stage of integrated circuit (IC) chip development.
