Last night, the Global Semiconductor Alliance (GSA) celebrated the achievements of remarkable individuals and exceptional semiconductor companies at its annual GSA Awards Ceremony gala. Join us in congratulating this year’s recipients.
AI
Thermal Impact of 3D Stacking Photonic and Electronic Chips
Researchers investigate how the thermal penalty of 3D integration can be minimized.
Micron Unveils Client SSD to Fuel Demanding PC Applications
Micron Technology, Inc. today announced it is shipping the Micron 3500 NVMe SSD, which leverages its 232-layer NAND to power demanding workloads for business applications, scientific computing, cutting-edge gaming and content creation, pushing the limits of what is possible.
Brainstorming With a Bot
CFN’s Kevin Yager develops a chatbot with an expertise in nanomaterials.
2D Material Reshapes 3D Electronics for AI Hardware
Researchers demonstrated monolithic 3D integration of layered 2D material into novel processing hardware for artificial intelligence computing. The new approach provides a material-level solution for fully integrating many functions into a single, small electronic chip — and paves the way for advanced AI computing.
Vertiv Collaborates with Intel on Liquid Cooled Solution for the Intel Gaudi3 AI Accelerator Platform
Intel’s next-generation AI accelerators will be supported by Vertiv liquid-cooled data center infrastructure solutions to help organizations accelerate AI adoption while achieving sustainability goals.
What’s in the November/December Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the November/December issue.
Untether AI Joins UCIe Consortium to Drive Chiplet Technology and Energy-Centric AI Acceleration
Untether AI today announced that it has joined Universal Chiplet Interconnect Express (UCIe) Consortium, the industry organization that has developed an open specification that defines the interconnect between chiplets within a package.
Market Leaders Collaborate with Synopsys to Realize Gains of Generative AI Across Synopsys.ai Full EDA Stack
Synopsys, Inc. today announced the expansion of its leading Synopsys.ai EDA suite, to bring the power of generative artificial intelligence (GenAI) across the full stack in order to dramatically improve engineering productivity for the semiconductor industry.
BrainChip Announces Dr. Tony Lewis as the New Chief Technology Officer
BrainChip Holdings Ltd, the world’s first commercial producer of ultra-low power, fully digital, neuromorphic AI IP, today announced the hiring of M. Anthony (Tony) Lewis as the new Chief Technology Officer (CTO) and the planned retirement of co-founder and CTO Peter Van der Made which is scheduled for the end of the year.
